Process for forming deposited film for light-receiving member, light-received member produced by the process deposited film forming apparatus, and method for cleaning deposited film forming apparatus

• US 5,817,181 A
• Filed: 07/24/1995
• Issued: 10/06/1998
• Est. Priority Date: 10/23/1992
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Kojima, Satoshi, Okamura, Ryuji, Yamamura, Masaaki, Akiyama, Kazuyoshi, Ohtoshi, Hirokazu, Murayama, Hitoshi, Hitsuishi, Koji
• Primary Examiner(s): Warden, Jill
• Assistant Examiner(s): Markoff, Alexander
• Application Number:
  US08/506,347
• Time in Patent Office: 1,170 Days
• Field of Search: 134/1, 134/1.1, 134/1.2, 134/1.3, 430/128, 118/20.1, 118/620, 118/70
• US Class Current: 134/1.1
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: C23C 16/505 using radio frequency discharges
• CPC Class Codes: C23C 16/509 using internal electrodes
• CPC Class Codes: G03G 5/08214 Silicon-based
• CPC Class Codes: G03G 5/08221 comprising one or two silicon based layers
• CPC Class Codes: G03G 5/08235 comprising three or four silicon-based layers
• CPC Class Codes: G03G 5/08278 Depositing methods

Abstract

A process for producing a light-receiving member comprising a substrate and provided thereon a blocking layer and a photoconductive layer each comprised of a non-monocrystalline material is disclosed in which the blocking layer is comprised of a non-monocrystalline material comprising silicon atoms as matrix and at least one kind of atoms selected from the group consisting of carbon atoms, oxygen atoms and nitrogen atoms, the process comprising forming the blocking layer and the photoconductive layer by plasma CVD using glow discharge decomposition of a starting material gas caused by applying to the starting material gas an electromagnetic wave with a frequency of from 20 MHz to 450 MHz.

Claims

1. A method for cleaning an apparatus for forming a film by vapor phase deposition comprising:

(a) introducing an etching gas selected from the group consisting of ClF₃ gas and CF₄ gas from gaps between dummy substrates disposed in a circle in the apparatus to a discharge space circumscribed by the dummy substrates; and

thereafter

(b) applying to at least one of the dummy substrates an electromagnetic wave with a frequency from 20 MHZ to 450 MHZ to generate a plasma between the at least one of the dummy substrates to which the electromagnetic wave is applied and the remaining dummy substrates to which the electromagnetic wave is not applied to thereby remove a reaction product of the vapor phase deposition adhered to the inside of the apparatus.

2. The method according to claim 1, wherein the frequency is within the range of 51 MHz to 250 MHz.

3. The method according to claim 1, wherein the reaction product comprises silicon.

4. The method according to claim 1, wherein the reaction product comprises an inorganic material comprising silicon as a main component.

5. The method according to claim 1, wherein the film is employed in an electrophotographic photoconductive member.

6. The method according to claim 1 wherein the apparatus comprises heaters and the dummy substrates are disposed so as to surround the heaters.

7. The method according to claim 1 wherein the dummy substrates are cylindrical.

8. The method according to claim 6 wherein the dummy substrates are cylindrical.

9. The method according to claim 1, wherein the dummy substrates have the same shape of a substrate for forming the film.

10. The method according to claim 3, wherein the frequency is within the range of 51 MHz to 250 MHz.

11. The method according to claim 6, wherein the frequency is within the range of 51 MHz to 250 MHz.

12. The method according to claim 1, wherein the etching gas further comprises O₂ gas.

13. The method according to claim 1, wherein the remaining dummy substrates and the at least one of the dummy substrates to which the electromagnetic wave is applied are disposed alternatively.

14. The method according to claim 1, including providing a plurality of the dummy substrates to which the electromagnetic wave is applied and disposing the plurality of the dummy substrates to which the electromagnetic wave is applied at equal spacing with respect to all the dummy substrates.