Methods of fabricating an HDMI decal chip scale package

• US 5,817,541 A
• Filed: 03/20/1997
• Issued: 10/06/1998
• Est. Priority Date: 03/20/1997
• Status: Expired due to Fees

• Current Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Trask, Philip A., Averkiou, George
• Primary Examiner(s): PICARDAT, KEVIN M
• Application Number:
  US08/822,092
• Time in Patent Office: 565 Days
• Field of Search: 438/622, 438/623, 438/107, 438/110, 438/113
• US Class Current: 438/107
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/02 Bonding areas; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/02319 by using a preform
• CPC Class Codes: H01L 2224/02381 Side view
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 24/02 Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Methods of producing a chip scale package that enables any chip with peripheral bond pads to be converted to an area array chip scale package suitable for chip on board assembly. The present invention produces the equivalent of a flip chip die when a chip supplier does not provide one. Processing is performed that provides thin film metal interconnections between the chip bond pads and area array bond pads on the bottom of the package. High reliability thin film metal interconnections are thus provided that connect the bond pads of the chip to the area array bond pads to permit external connection to the chip.

Claims

1. A method of fabricating a high density multilayer interconnect (HDMI) decal chip scale package, said method comprising the steps of:

depositing and curing a layer of polyimide on a transparent substrate;

depositing and patterning pad metal comprising metal pads on the layer of polyimide;

depositing and curing a second layer of polyimide over the metal pads;

patterning and etching vias to the metal pads;

depositing and patterning a metal interconnect layer that provides for connection to the metal pads;

depositing and curing a third layer of polyimide over the metal interconnect layer;

applying a layer of adhesive to areas where chips are to be attached;

attaching chips face down onto the layer of adhesive so that their peripheral bond pads are adhesively attached to the third layer of polyimide;

attaching a plate to backs of the chips to produce an HDMI decal;

delaminating the HDMI decal from the transparent substrate;

forming vias through the second and third layers of polyimide to expose selected metal pads and portions of the metal interconnect layer;

depositing a second metal interconnect layer on the exposed surface of the second and third layer of polyimide;

depositing a layer of dielectric material on the surface of the second metal interconnect layer to fill depressions therein where the vias were formed;

curing the dielectric material to form an etch mask to protect regions where contact between the metal pads and the metal interconnect layer is made;

etching the surface of the HDMI decal through the layer of dielectric material forming the etch mask;

depositing area array bonding pads in a predetermined configuration to connect to the metal pads that permit external connection to the chip;

separating the chips from each other; and

releasing the separated chips from the plate.

2. The method of claim 1 wherein the step of attaching the plate to backs of the chips comprises using adhesive.

3. The method of claim 1 further comprising the step of:

machining the backs of the chips in situ to provide a flat level surface for attachment of the plate.

4. The method of claim 1 wherein the vias are formed by laser ablation through the layers of polyimide.

5. The method of claim 1 wherein the step of depositing the dielectric material comprises the step of depositing polyimide.

6. The method of claim 1 wherein the step of depositing area array bonding pads is achieved by plating the area array bonding pads.

7. The method of claim 1 wherein the step of separating the chips from each other comprises the step of laser ablating the second and third layers of polyimide.

8. The method of claim 1 wherein the step of releasing the separated chips from the plate comprises the step of heating the plate.

9. A method of fabricating a high density multilayer interconnect (HDMI) decal chip scale package, said method comprising the steps of:

fabricating an HDMI decal on a substrate;

attaching a chip having a plurality of bond pads face down onto the HDMI decal;

delaminating the HDMI decal from its underlying substrate;

forming vias in the HDMI decal that expose the bond pads on the chip;

processing the HDMI decal to provide interconnect metal that connects to the bond pads on the chip;

masking connection areas and removing portions of the interconnect metal to form bonding areas; and

processing the bonding areas to provide a chip scale package having area array bond pads.