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Method of reducing wafer particles after partial saw

  • US 5,817,569 A
  • Filed: 05/08/1997
  • Issued: 10/06/1998
  • Est. Priority Date: 05/08/1997
  • Status: Expired due to Term
First Claim
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1. A method of fabricating a monolithic device from a wafer, comprising the steps of:

  • a) partially fabricating the device by depositing a first and second layer of photoresist on the wafer, wherein said first and second layers are compatible with each other, with a structure disposed therebetween;

    b) partially sawing the wafer to form kerfs; and

    c) cleansing the device with a solution of buffered hydrofluoric acid (HF) having a concentration of at least 1%, wherein said compatible first and second photoresist layers prevent the HF solution from permeating the second photoresist layer and damaging the structure.

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