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Chip stacking by edge metallization

  • US 5,818,107 A
  • Filed: 01/17/1997
  • Issued: 10/06/1998
  • Est. Priority Date: 01/17/1997
  • Status: Expired due to Term
First Claim
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1. An electronic integrated circuit package includinga substrate including a bonding pad, andan integrated circuit chip including a metallization feature including metallization deposited on opposing areas on major surfaces of said integrated circuit chip and across an edge of said integrated circuit chip between said opposing areas and bonded to said substrate in an orientation substantially parallel to said substrate with a bonding material by a bond between said bonding pad and said metallization feature.

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