Solder preforms

• US 5,820,014 A
• Filed: 01/11/1996
• Issued: 10/13/1998
• Est. Priority Date: 11/16/1993
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Khandros, Igor Y., Dozier, Thomas H. II
• Primary Examiner(s): Ryan, Patrick
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US08/584,981
• Time in Patent Office: 1,006 Days
• Field of Search: 228/56.3, 228/246
• US Class Current: 228/56.3
• CPC Class Codes: B23K 35/02 characterised by mechanical features, e.g. shape
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof

Abstract

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.

Claims

1. A solder preform, adapted in use for forming solder balls on a surface of at least one electronic component or for forming solder joints between two electronic components, comprising:

a plurality of relatively large solid solder masses connected to one another by a relatively thin sheet of solder; and

weakening lines extending between the solder masses;

wherein;

the weakening lines are regions of reduced thickness.

2. A solder preform, adapted in use for forming solder balls on a surface of at least one electronic component or for forming solder joints between two electronic components, comprising:

a plurality of relatively large solid solder masses connected to one another by a relatively thin sheet of solder;

wherein;

the relatively thin sheet of solder has a thickness; and

further comprising;

elongate regions of reduced thickness extending in the sheet between the solder masses.

3. A solder preform, according to claim 2, wherein:

the elongate regions of reduced thickness are in the form of channels running between the solder masses.

4. A solder preform, according to claim 2, wherein:

the elongate regions are arranged in a grid pattern.

5. A solder preform, adapted in use for forming solder balls on a surface of at least one electronic component, comprising:

a plurality of relatively large solid solder masses connected to one another by a relatively small volume amount of solder; and

a carrier supporting the solder masses.

6. A solder preform, according to claim 5, wherein:

the relatively small volume of solder is in the form of a thin sheet.

7. A solder preform, according to claim 5, wherein:

the relatively small volume of solder is in the form of bridges connecting the solder masses to one another.

8. A solder preform, according to claim 5, wherein:

the carrier is an aluminum sheet.

9. A solder preform, according to claim 5, wherein:

the carrier is in the form of a tape and supports a plurality of solder preforms.

10. A solder preform, according to claim 5, wherein:

the carrier is in the form of a film.

11. A solder preform, according to claim 10, further comprising:

a plurality of holes in the film, said holes being aligned with the relatively large solder masses.

12. A solder preform, according to claim 10, further comprising:

an adhesive applied to the film.

13. A solder preform, according to claim 5, further comprising:

a plurality of spring elements mounted to the solder preform.

14. A solder preform, according to claim 13, further comprising:

at least one layer of a metallic material disposed between the spring elements and the solder preform.

15. A solder preform, according to claim 13, wherein:

the spring elements are mounted to the relatively large solder masses.

16. A solder preform, according to claim 15, wherein:

the spring elements are composite interconnection elements.