Wet chemical treatment system and method for cleaning such system

• US 5,820,689 A
• Filed: 12/04/1996
• Issued: 10/13/1998
• Est. Priority Date: 12/04/1996
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tseng, Wen-Hsiang, Lu, Kuo-Liang, Chang, B. J.
• Primary Examiner(s): EL ARINI, ZEINAB
• Application Number:
  US08/767,117
• Time in Patent Office: 678 Days
• Field of Search: 134/3, 134/10, 134/2, 134/25.4, 134/26, 134/28, 134/41, 134/104.1, 134/108, 134/111, 134/902
• US Class Current: 134/3
• CPC Class Codes: B08B 9/00 Cleaning hollow articles by methods or apparatus specially adapted thereto B08B6/00 takes precedence
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A wet chemical treatment system for processing semiconductor wafers that does not have the problem of cracking or other damages occurring in the system during a cleaning process where a strong acid and water are mixed and pressure and heat are generated. The system includes an additional filing system such that only an outer tank for the processing liquid is filled after the system is cleaned so that pressure and heat generated by the reaction between acid and water can be released into an empty inner tank and thus avoiding damages caused by the heat and pressure. A method for cleaning such system is further disclosed.

Claims

1. A wet chemical treatment system for processing semiconductor wafers comprising:

a first tank and a second tank for holding a processing liquid, respectively, said first tank being isolated from said second tank except that said first tank when full overflows into said second tank;

a first passage means for providing fluid communication to said first tank;

a second passage means for providing fluid communication to said second tank;

a recirculating means connected between said first passage means and said second passage means;

a first filling means in fluid communication with said first passage means for filing said first tank; and

a second filling means in fluid communication with said second passage means for filling said second tank such that said second tank may be filled with a processing liquid independently from said first tank while maintaining said second tank empty for releasing pressure and heat generated in said first and said second passage means.

2. A wet chemical treatment system according to claim 1 further comprising filter means connected in series with said recirculation means and said first passage means.

3. A wet chemical treatment system according to claim 1 further comprising heating means connected in series with said recirculating means and said first passage means.

4. A wet chemical treatment system according to claim 1, wherein said second tank is situated inside said first tank.

5. A wet chemical treatment system according to claim 1, wherein said second tank is an inner tank and said first tank is an outer tank.

6. A wet chemical treatment system according to claim 1, wherein said processing liquid is a corrosive fluid.

7. A wet chemical treatment system according to claim 1, wherein said recirculating means is a pump.

8. A wet chemical treatment system according to claim 1 further comprising valve means for opening and closing said first passage means and said second passage means.

9. A wet chemical treatment system according to claim 1 further comprising valve means for opening and closing said first filling means and said second filling means.

10. A wet chemical treatment system according to claim 1, wherein said processing liquid is an acid.

11. A method of cleaning a wet chemical treatment system for processing semiconductor devices comprising the steps of:

providing a first tank and a second tank for holding a processing liquid respectively, said first tank being isolated from said second tank except that said first tank when fill overflows into said second tank;

providing a first passage means for providing fluid communication to said first tank and a second passage means for providing fluid communication to said second tank;

providing a first filling means in fluid communication with said first passage means and a second filling means in fluid communication with said second passage means;

providing a plurality of valve means for opening and closing said first, said second passage means and said first, said second filling means;

providing a draining means in fluid communication with said first and said second passage means;

emptying said treatment system including said first and said second tank, said first and said second passage means, and said first and said second filling means by said draining means;

filling said treatment system with a cleaning solvent and circulating said cleaning solvent through said treatment system;

exhausting from said treatment system said cleaning solvent by said draining means;

filling said first tank with said processing liquid through said first filling means while maintaining said second tank empty; and

circulating said processing liquid through said first and said second passage means such that pressure and heat generated upon mixing of said processing liquid with any residual cleaning solvent in said first and said second passage means is released into said empty second tank.

12. A method of cleaning a wet chemical treatment system according to claim 11, wherein said processing liquid is a corrosive fluid.

13. A method of cleaning a wet chemical treatment system according to claim 11, wherein said cleaning solvent is water.

14. A method of cleaning a wet chemical treatment system according to claim 11 further comprising the steps of filling and exhausting a recirculating means connected in series with said first and said second passage means with a cleaning solvent.

15. A method of cleaning a wet chemical treatment system according to claim 14, wherein said recirculating means is a pump.

16. A method of cleaning a wet chemical treatment system according to claim 11 further comprising the steps of filling and exhausting a recirculating means, a filter means and a heater means connected in series with said first and said second passage means with a cleaning liquid.

17. A method of cleaning a wet chemical treatment system according to claim 11, wherein said pressure and heat is generated by a chemical reaction between a processing liquid of acid and a cleaning solvent of deionized water.

18. A method of cleaning a wet chemical treatment system according to claim 11, wherein said processing liquid is sulfuric acid.

19. A wet chemical etch tank for processing silicon wafers comprising:

an inner tank and an outer tank for holding a processing liquid, respectively, said inner tank being isolated from said outer tank except that said outer tank when full overflows into said inner tank;

a first passage means for providing fluid communication to said inner tank;

a second passage means for providing fluid communication to said outer tank;

a pump means, a filter means and a heater means connected in series between said first passage means and said second passage means;

a first filling means in fluid communication with said first passage means for filing said inner tank; and

a second filling means in fluid communication with said second passage means for filling said outer tank such that said outer tank can be filled independently with a processing liquid while said inner tank is kept empty for releasing pressure and heat generated in said first and said second passage means by a reaction between said processing liquid and a cleaning solvent.

20. A wet chemical etch tank according to claim 19 further comprising a plurality of valve means for opening and closing said first and said second passage means, and said first and said second filling means.