Process for depositing a material on a substrate using light energy
First Claim
1. A process for forming an electrical insulating layer in an integrated circuit comprising the steps of:
- providing a solution containing an electrical insulating material and a solvent, said electrical insulating material comprising an amorphous fluorocarbon polymer;
atomizing said solution into droplets, said droplets being released into a processing chamber, said processing chamber containing a substrate comprising a semiconductive material, said droplets being deposited onto said substrate;
exposing said processing chamber to a combination of a first light energy source and a second light energy source while said droplets are being deposited on said substrate, said first light energy source emitting ultraviolet light energy, said second light energy source emitting thermal light energy, said light energy causing said amorphous fluorocarbon polymer to polymerize and form a solid coating on said substrate, said solid coating having a dielectric constant of less than about three.
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Accused Products
Abstract
The present invention is generally directed to a process and a system for transforming a liquid into a solid material using light energy. In particular, a solution containing a parent material in a liquid form is atomized in a reaction vessel and directed towards a substrate. The atomized liquid is exposed to light energy which causes the parent material to form a solid coating on a substrate. The light energy can be provided from one or more lamps and preferably includes ultraviolet light. Although the process of the present invention is well suited for use in many different and various applications, one exemplary application is in depositing a dielectric material on a substrate to be used in the manufacture of integrated circuit chips.
84 Citations
40 Claims
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1. A process for forming an electrical insulating layer in an integrated circuit comprising the steps of:
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providing a solution containing an electrical insulating material and a solvent, said electrical insulating material comprising an amorphous fluorocarbon polymer; atomizing said solution into droplets, said droplets being released into a processing chamber, said processing chamber containing a substrate comprising a semiconductive material, said droplets being deposited onto said substrate; exposing said processing chamber to a combination of a first light energy source and a second light energy source while said droplets are being deposited on said substrate, said first light energy source emitting ultraviolet light energy, said second light energy source emitting thermal light energy, said light energy causing said amorphous fluorocarbon polymer to polymerize and form a solid coating on said substrate, said solid coating having a dielectric constant of less than about three. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A process for forming an electrical insulating layer in an integrated circuit comprising the steps of:
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providing a solution containing an electrical insulating material in a liquid form, said electrical insulating material comprising a material selected from the group consisting of a fluorocarbon polymer and a polyimide polymer; atomizing said solution into liquid droplets; directing said liquid droplets into a processing chamber towards a substrate; exposing said processing chamber to a combination of optical light energy and thermal light energy prior to said liquid droplets contacting said substrate, said light energy causing atomic and molecular excitation and said thermal light energy causing vibrational motion of molecules, said light energy causing said electrical insulating material to polymerize and form a solid coating on said substrate, said solid coating having a dielectric constant of less than about three. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A process for forming an electrical insulating layer in an integrated circuit comprising the steps of:
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providing a solution containing an electrical insulating material and a solvent; atomizing said solution into droplets, said droplets being released into a processing chamber, said processing chamber containing a substrate comprising a semiconductive material, said droplets being deposited onto said substrate; and exposing said processing chamber to a combination of optical light energy and thermal light energy while said droplets are being deposited onto said substrate, said light energy causing substantially all of said solvent contained within said droplets to evaporate prior to said electrical insulating material contacting said substrate, said light energy also causing said electrical insulating material to polymerize and form a continuous solid coating on said substrate, said solid coating having a dielectric constant of less than about three. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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35. A process for forming an electrical insulating layer in an integrated circuit comprising the steps of:
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providing a solution containing an electrical insulating material and a solvent; atomizing said solution into droplets, said droplets being released into a processing chamber, said processing chamber containing a substrate comprising a semiconductive material, said droplets being deposited onto said substrate; and exposing said processing chamber to light energy as said droplets are deposited onto said substrate, said light energy comprising vacuum ultraviolet light, said vacuum ultraviolet light causing said electrical insulating material to polymerize and form a solid coating on said substrate. - View Dependent Claims (36, 37, 38, 39, 40)
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Specification