×

Imager package substrate

  • US 5,821,532 A
  • Filed: 06/16/1997
  • Issued: 10/13/1998
  • Est. Priority Date: 06/16/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. An image head assembly comprising:

  • a printed circuit substrate with at least a pair of apertures formed in the substrate;

    a cover glass assembly having at least a pair of pins that mate with the apertures within the printed substrate, the pins to the cover glass assembly being fixedly secured to the apertures within the printed circuit substrate;

    an image sensor located on the printed circuit substrate between the apertures and covered by a cover glass on the cover glass assembly and above the image sensor;

    interface means for providing an electrical connection between the substrate and the image sensor.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×