Imager package substrate
First Claim
1. An image head assembly comprising:
- a printed circuit substrate with at least a pair of apertures formed in the substrate;
a cover glass assembly having at least a pair of pins that mate with the apertures within the printed substrate, the pins to the cover glass assembly being fixedly secured to the apertures within the printed circuit substrate;
an image sensor located on the printed circuit substrate between the apertures and covered by a cover glass on the cover glass assembly and above the image sensor;
interface means for providing an electrical connection between the substrate and the image sensor.
2 Assignments
0 Petitions
Accused Products
Abstract
An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the substrate, the pins to the optical assembly being fixedly secured to the apertures within the substrate; an image sensor located between the apertures covered by a cover glass above the image sensor on the optical assembly; interface means for providing an electrical connection between the substrate and the image sensor; a lens system mounted on top the cover glass; and a single element blur filter contained within the lens system. The assembly contains a single element blur filter such as a cross-pleated blur filter. The lens system is prevented from being a reverse telephoto lens system with use of a blur filter that does not require a large back focus and is instead a telephoto lens system.
394 Citations
8 Claims
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1. An image head assembly comprising:
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a printed circuit substrate with at least a pair of apertures formed in the substrate; a cover glass assembly having at least a pair of pins that mate with the apertures within the printed substrate, the pins to the cover glass assembly being fixedly secured to the apertures within the printed circuit substrate; an image sensor located on the printed circuit substrate between the apertures and covered by a cover glass on the cover glass assembly and above the image sensor; interface means for providing an electrical connection between the substrate and the image sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification