Integrated circuit device having shield structure against electromagnetic wave

• US 5,821,604 A
• Filed: 03/08/1996
• Issued: 10/13/1998
• Est. Priority Date: 03/09/1995
• Status: Expired due to Fees

• Current Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Original Assignee: NEC Corporation
• Inventors: Egawa, Hidenori
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/613,136
• Time in Patent Office: 949 Days
• Field of Search: 257/659, 257/660, 257/778, 257/701, 257/737, 257/699
• US Class Current: 257/659
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0219 : Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10969 : Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 2201/10992 : Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 3/3431 : Leadless components
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A hybrid integrated circuit device is equipped with a shield structure, and the shield structure has a peripheral shield frame soldered to a peripheral shield member of a mother board so as to encircle electrodes of the hybrid integrated circuit device therewith, thereby decreasing noise due to the electromagnetic wave generated by the electrodes.

Claims

1. An integrated circuit device mounted on a board having an insulating layer and a plurality of conductive lands formed on a surface of said insulating layer, comprising:

at least one circuit component;

a package including

an insulating member for accommodating said at least one circuit component, and

a plurality of first electrodes formed on a central area of one surface of said insulating member and electrically connected to said at least one component, said plurality of first electrodes being fixed to said conductive lands when said integrated circuit device is mounted on said board; and

a shield structure including

a conductive wall covering another surface of said insulating member,

a conductive frame formed over an outer peripheral area of said one surface so as to encircle said plurality of first electrodes therewith, and

a frame formed on said surface of said insulating layer so as to encircle said conductive lands.

2. The integrated circuit device as set forth in claim 1, in which said at least one circuit component forms a part of a hybrid integrated circuit.

3. The integrated circuit device as set forth in claim 1, in which said plurality of first electrodes have a first height measured from said one surface and approximately equal to a second height of said conductive frame measured from said one surface.

4. The integrated circuit device as set forth in claim 3, in which said first height of said plurality of first electrodes ranges from 0.1 millimeter to 1 millimeter.

5. The integrated circuit device as set forth in claim 1, in which said package further includes at least one second electrode formed on a certain area of said one surface outside of said conductive frame.

6. The integrated circuit device as set forth in claim 1, in which said conductive frame is held in contact with said conductive wall.

7. The integrated circuit device as set forth in claim 1, in which said conductive wall has a side sub-wall covering a side wall of said insulating member, a bottom sub-wall covering a lower surface of said insulating member so as to be merged with said side sub-wall and spaced from said plurality of first electrodes, and a top sub-wall covering an upper surface of said insulating member and held in contact with said side sub-wall.

8. The integrated circuit device as set forth in claim 7, in which said conductive frame is formed on conductive wall over said one surface.

9. The integrated circuit device as set forth in claim 1, in which said conductive frame is partially discontinued so as to form an opening, and said opening is closed by a solder piece during a mounting stage when said integrated circuit device is soldered to said board.