Organic electroluminescent device hermetic encapsulation package

• US 5,821,692 A
• Filed: 11/26/1996
• Issued: 10/13/1998
• Est. Priority Date: 11/26/1996
• Status: Expired due to Term

• Current Assignee: Universal Display Corporation
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: So, Franky, Webb, Brian A., Rogers, Stephen P., Shi, Song Q.
• Primary Examiner(s): Patel, Vip
• Application Number:
  US08/757,002
• Time in Patent Office: 686 Days
• Field of Search: 313/512, 313/506, 313/483, 313/493, 315/169.3, 428/690, 428/917
• US Class Current: 313/512
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling

Abstract

An organic electroluminescent device array encapsulating package including an organic electroluminescent device on a supporting substrate. A cover having a rim engaging the supporting substrate is spaced from and hermetically encloses the organic electroluminescent device. A dielectric liquid having benign chemical properties fills the space between the cover and the organic electroluminescent device, providing both an efficient medium for heat transmission and an effective barrier to oxygen and moisture.

Claims

1. An organic electroluminescent device encapsulating package comprising:

an organic device on a supporting substrate;

a cover having a rim engaging the supporting substrate, and heat dissipating fins the cover spaced from and enclosing the organic electroluminescent device;

sealing material sealingly coupling the rim of the cover to the supporting substrate around the organic electroluminescent device and spaced therefrom; and

a dielectric liquid having benign chemical properties filling the space between the cover and the organic electroluminescent device, the dielectric liquid including a fluorinated carbon liquid.

2. An organic electroluminescent device encapsulating package as claimed in claim 1 wherein the supporting substrate includes a transparent material.

3. An organic electroluminescent device encapsulating package as claimed in claim 2 wherein the organic electroluminescent device includes an organic layer positioned between a first contact and a second contact, the first contact being adjacent the transparent substrate and including a transparent material.

4. An organic electroluminescent device array encapsulating package comprising:

an organic electroluminescent device array carried by a transparent substrate;

a cover having an inner surface defining a chamber;

a rim defining an opening in communication with the chamber and heat dissipating fins, the organic electroluminescent device being received in the chamber with the inner surface spaced therefrom;

sealing material sealingly coupling the rim of the cover to the transparent substrate around the organic electroluminescent device and spaced therefrom; and

a dielectric liquid having benign chemical properties filling the chamber and engulfing the organic electroluminescent device, the dielectric liquid including a fluorinated carbon liquid.

5. An organic electroluminescent device encapsulating package comprising:

an organic device on a supporting substrate;

a cover having a rim engaging the supporting substrate, the cover being spaced from and enclosing the organic electroluminescent device, and the cover including fins extending outwardly therefrom to facilitate heat dissipation;

sealing material sealingly coupling the rim of the cover to the supporting substrate around the organic electroluminescent device and spaced therefrom; and

a dielectric liquid having benign chemical properties filling the space between the cover and the organic electroluminescent device.

6. An organic electroluminescent device encapsulating package as claimed in claim 5 wherein the cover includes a heat conductive metal.

7. An organic electroluminescent device array encapsulating package comprising:

an organic electroluminescent device array carried by a transparent substrate;

a cover having an inner surface defining a chamber and having a rim defining an opening in communication with the chamber, the organic electroluminescent device being received in the chamber with the inner surface spaced therefrom, and the cover further including an outer surface having fins extending therefrom to facilitate heat dissipation;

sealing material sealingly coupling the rim of the cover to the transparent substrate around the organic electroluminescent device and spaced therefrom; and

a dielectric liquid having benign chemical properties filling the chamber and engulfing the organic electroluminescent device.

8. An organic electroluminescent device array encapsulating package as claimed in claim 7 wherein the cover includes a heat conductive metal.