Method and apparatus for detecting shorts in a multi-layer electronic package

• US 5,821,759 A
• Filed: 02/27/1997
• Issued: 10/13/1998
• Est. Priority Date: 02/27/1997
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Yarmchuk, Edward J., Yu, Yuet-Ying, Scaman, Michael E.
• Primary Examiner(s): Do, Diep N.
• Application Number:
  US08/807,076
• Time in Patent Office: 593 Days
• Field of Search: 324/522, 324/527, 324/529, 324/537, 324/538, 324/750, 324/765, 324/158.1, 324/95, 324/754, 438/14, 438/17
• US Class Current: 324/529
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 31/281 Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing G01R31/2818 takes precedence
• CPC Class Codes: G01R 31/52 Testing for short-circuits, leakage current or ground faults

Abstract

A method and apparatus for locating shorts in multi-layer electronic packages during manufacture allows repair of the shorts and improved yields of the packages. A multi-layer package is fitted in a fixture after forming a thin film layer of metalization, and test is performed to detect shorts in the package. If a short is detected, a low current, high frequency signal is injected in pins on a bottom surface of the package. An approximate two dimensional location of the short is sensed by detecting an electromagnetic force induced by a magnetic field inductively coupled to a sensor proximate to the short on a top surface of the multi-layer package. The approximate location of the short is then inspected to precisely locate the short.

Claims

1. A method for locating shorts in multi-layer electronic packages during manufacture, comprising steps of:

fitting a multi-layer package in a fixture, after forming a thin film layer of metalization on a top surface of the package;

detecting a short in the top surface of the package;

injecting a first test signal into a set of pins on a bottom surface of the package;

detecting a magnetic field produced by a short on the top surface when said first test signal is applied to said set of pins, the short being at least one of a short between planes of the package and an I/O-to-plane short of the package;

determining an approximate two-dimensional location of the short on the top surface based on a location of said magnetic field as detected in said detecting step; and

inspecting the top surface at the approximate location of the short to determine a location of the short within said approximate location.

13. The method recited in claim 1, wherein said detecting step includes moving a probe over said top surface to detect said magnetic field, said probe detecting said magnetic field as a back electromotive force induced in a coil of the probe which is 90°

out of phase with said first test signal.

14. The method recited in claim 1, wherein said first test signal is a low current, high frequency signal.

15. The method recited in claim 1, wherein at least one of said approximate location and said location within said approximate location is a two-dimensional location relative to the top surface of the package.

16. The method recited in claim 1, wherein said short between planes is a short between voltage planes of the package, and wherein said I/O-to-plane short is an I/O-to-voltage plane short of the package.

17. The method recited in claim 1, wherein said step of detecting a short in the top surface of the package includes simultaneously testing a plurality of I/O nets to power to detect the short.

2. The method recited in claim I wherein the step of detecting said magnetic field comprises steps of moving an iron core inductor across the top surface of the multi-layer package, and detecting induced in the iron core inductor by said magnetic field, and

wherein said method further comprises a step of providing an output signal indicative of the approximate location of the short.

3. The method recited in claim 2 wherein the step of providing an output signal comprises the steps of:

generating a visual indication of detected signal strength; and

generating an audible indication of the detected signal strength.

4. The method recited in claim 2 further comprising steps of:

injecting a second test signal in said set of pins on the bottom surface of the package, said second test signal having a different frequency from the first test signal;

detecting a second high frequency signal induced in the iron core inductor by the second test signal; and

detecting the approximate location of the short based on the first and second high frequency signals.

5. The method recited in claim 4 wherein the first and second signals are injected in a sequential order.

6. The method recited in claim 4 wherein the first and second signals are injected simultaneously, and wherein, before the step of detecting the approximate location of the short based on the first and second high frequencys signal, a step of combining the first and second high frequency signals is performed by multiplying the first and second high frequency signals.

7. The method recited in claim 4, wherein said second test signal is a low current, high frequency signal.

8. The method recited in claim 4, wherein said first test signal is injected into an entry point on the bottom surface of the package different from an entry point into which said second test signal is injected.

9. The method recited in claim 2 wherein the step of moving the iron core inductor across the top surface of the multi-layer package is performed by a stage which supports the fixture, said method further comprising the steps of:

converting the output signal to a digital signal; and

controlling movement of said stage with a computer to maximize the output signal, the computer providing the output signal indicative of the approximate location of the short.

10. The method recited in claim 9, wherein the iron core inductor is mounted in relation to a microscope having an objective lens proximate to the top surface of the multi-layer package, said microscope being used to determine the location of the short within said approximate location.

11. The method recited in claim 9 wherein said stage is moveable in three perpendicular axes, the stage being controlled by the computer to maximize the detected output in a plane parallel to the top surface and then moved in a perpendicular direction to said plane to provide an indication of a depth of the short within said multi-layer package.

12. The method recited in claim 9, wherein said computer maximizes said output signal by moving said stage to a position, relative to the top surface, where said magnetic field is detected to be maximum.

18. An apparatus for locating shorts in multi-layer electronic packages during manufacture comprising:

a fixture for receiving a multi-layer package after a thin film layer of metalization had been formed on a top surface of the package;

a set of pins on a bottom surface of the package;

a reference signal generating circuit which applies a first test signal to said set of pins; and

a sensor movable in a plane parallel to the top surface of the package for detecting a magnetic field produced by a short on the top surface when said first test signal is applied to said set of pins, the short being at least one of a short between planes of the package and an I/O-to-plane short of the package;

wherein a location of said magnetic field relative to the top surface corresponds to an approximate two-dimensional location of the short.

19. An apparatus as recited in claim 18 wherein the sensor comprises an iron core inductor generating an output signal indicative of a strength of said magnetic field, and wherein said apparatus further comprises a first detecting circuit for receiving the output signal and providing a first output indicative of the approximate location of the short.

20. The apparatus recited in claim 19 further comprising a visual indicator responsive to the output of the detecting circuit.

21. An apparatus as recited in claim 19 further comprising:

a voltage controlled oscillator responsive to the output of the detecting circuit; and

a speaker responsive to an output of the voltage controlled oscillator for generating an audible indication of the detected signal strength.

22. An apparatus as recited in claim 19 further comprising:

a second reference signal generating means for injecting a second test signal in at least one of said pins, said second signal having a different frequency from the first test signal;

a second detecting circuit for receiving the output sisal from the sensor and providing a second output indicative of the approximate location of the short; and

a circuit for combining the outputs from the first and second detection circuits to provide an indication of the approximate location of the short.

23. An apparatus as recited in claim 19, wherein said approximate location corresponds to a location on the top surface where said output signal corresponds to a maximum strength of said magnetic field.

24. An apparatus recited in claim 19 further comprising:

a stage supporting said fixture, said stage being movable in two dimensions in a plane parallel to the top surface of the multi-layer package;

an analog-to-digital converter for converting an output of the first detecting circuit to a digital signal; and

a computer connected to receive said digital signal and programmed to control said stage to maximize the signal output of the first detecting circuit.

25. An apparatus as recited in claim 24 wherein the iron core inductor is mounted in relation to a microscope having an objective lens proximate to the top surface of the multi-layer package, said microscope being used to determine a location of the short within said approximate location.

26. An apparatus as recited in claim 24 wherein said stage is movable in three perpendicular axes, the stage being controlled by the computer to maximize the output from the first detecting circuit in a plane parallel to the top surface of the multi-layer package and to move said stage in a direction perpendicular to said plane to provide an indication of a depth of the short within said multi-layer package.

27. An apparatus as recited in claim 26, wherein said computer moves said stage to a location where said sensor detects a maximum strength of said magnetic field, and wherein said location where said sensor detects the maximum strength of said magnetic field corresponds to said approximate location.

28. An apparatus as recited in claim 18 wherein the sensor comprises a predetermined number of iron core inductors which are differentially wound, said iron core inductors generating an output signal similar to a correlation detection signal, and wherein said apparatus further comprises a detecting circuit for receiving the output signal and providing an output indicative of the approximate location of the short.

29. An apparatus as recited in claim 28, wherein said predetermined number is an even number.

30. An apparatus as recited in claim 18, wherein said sensor is moved over the top surface to detect said magnetic field as a back electromotive force induced in a coil of the probe which is 90°

out of phase with said first test signal.

31. An apparatus as recited in claim 18, wherein said short between plane between voltage planes of the package, and wherein said I/O-to-plane short is an I/O-to-voltage plane short of the package.