Card type memory device and a method for manufacturing the same
First Claim
1. A card type memory unit comprising:
- a semiconductor package including a semiconductor chip having a nonvolatile memory with external connection terminals formed there;
a metal frame comprising bed sections with the semiconductor chip mounted thereon and external terminal electrode sections with a step section defined between the bed section and the external terminal electrode section, the external connection terminal of the semiconductor chip being electrically connected to the corresponding bed section, and a resin section with which at least one surface of the semiconductor chip and outer peripheral surface and at least electrode surfaces of the external terminal electrode section of the metal frame are sealed such that at least the electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with an outer surface of the resin section; and
a card-type base board having a recess in which the semiconductor package is buried such that the exposed electrode surfaces of the metal frame and resin-sealed surface of the semiconductor package are exposed substantially flush with an outer surface of the base board.
1 Assignment
0 Petitions
Accused Products
Abstract
A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.
264 Citations
8 Claims
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1. A card type memory unit comprising:
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a semiconductor package including a semiconductor chip having a nonvolatile memory with external connection terminals formed there;
a metal frame comprising bed sections with the semiconductor chip mounted thereon and external terminal electrode sections with a step section defined between the bed section and the external terminal electrode section, the external connection terminal of the semiconductor chip being electrically connected to the corresponding bed section, and a resin section with which at least one surface of the semiconductor chip and outer peripheral surface and at least electrode surfaces of the external terminal electrode section of the metal frame are sealed such that at least the electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with an outer surface of the resin section; anda card-type base board having a recess in which the semiconductor package is buried such that the exposed electrode surfaces of the metal frame and resin-sealed surface of the semiconductor package are exposed substantially flush with an outer surface of the base board. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A card type memory device comprising:
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(a) a card type memory unit comprising a semiconductor package including a semiconductor chip having a nonvolatile memory with external connection terminals formed there;
a metal frame comprising bed sections with the semiconductor chip mounted thereon and external terminal electrode sections with a step section defined between the bed section and the external terminal electrode section, the external connection terminals of the semiconductor chip being electrically connected to the corresponding bed sections, and a resin section with which at least one surface of the semiconductor chip and outer peripheral surface and at least electrode surfaces of the external terminal electrode section of the metal frame are sealed such that at least the electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with an outer surface of the resin section; anda card-type base board having a recess in which the semiconductor package is buried such that the exposed electrode surfaces of the metal frame and resin-sealed surface of the semiconductor package are exposed substantially flush with an outer surface of the base board; and (b) a card type adaptor comprising a card holding section for allowing the card type memory unit to be inserted therein or withdrawn therefrom; a connector which, with the card type memory unit set in the card holding section, is set in contact with, and electrically connected to, the electrode surfaces of the external terminal electrode sections of the card type memory unit; and an interface section having an interface function to an associated apparatus. - View Dependent Claims (8)
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Specification