Process of making an integrated circuit chip composite

• US 5,824,568 A
• Filed: 07/05/1996
• Issued: 10/20/1998
• Est. Priority Date: 12/10/1992
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Zechman, John Harold
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): BILODEAU, THOMA
• Application Number:
  US08/675,822
• Time in Patent Office: 837 Days
• Field of Search: 437/211, 437/219, 29/855, 438/112, 438/121, 438/124
• US Class Current: 438/112
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 2224/05601 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/4557 Plural coating layers
• CPC Class Codes: H01L 2224/456 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48011 Length
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48724 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48744 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85815 Reflow soldering
• CPC Class Codes: H01L 2224/85909 Post-treatment of the connector or wire bonding area
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/293 : Organic, e.g. plastic
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/4952 : the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49524 : the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/642 : Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/06 : Polymers polymers per se C08; polymer adhesives C09J
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20656 : larger or equal to 5000 microns less than 6000 microns
• CPC Class Codes: H01L 2924/20657 : larger or equal to 6000 microns less than 7000 microns
• CPC Class Codes: H01L 2924/20658 : larger or equal to 7000 microns less than 8000 microns
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 29/49171 : with encapsulating

Abstract

A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

Claims

1. A method for fabricating a composite which comprises providing an integrated circuit chip having electrically conductive site thereon;

interconnecting conductive lead to said conductive site with electrically conductive wire wherein said wire is at least 5 mm long;

then conformally coating said wire with a dielectric material wherein said dielectric is parylene; and

then encapsulating the chip, wire and portion of said conductive lead in a dielectric encapsulating composition.

2. The method of claim 1 wherein said electrically conductive site is aluminum.

3. The method of claim 1 wherein said conductive lead is copper.

4. The method of claim 1 wherein said conductive lead is gold-plated copper.

5. The method of claim 1 wherein said dielectric material is parylene N.

6. The method of claim 1 wherein the dielectric material is about 0.0001 to about 0.0003 inches thick.

7. The method of claim 1 wherein parylene is coated on said wire by vapor deposition.

8. The method of claim 1 wherein said dielectric material is about 0.0001 to about 0.001 inches thick.

9. The method of claim 1 wherein said wire is 0.0005 to about 0.003 inches thick.

10. The method of claim 1 wherein said wire is gold wire.

11. The method of claim 1 wherein said encapsulating composition is an epoxy composition.

12. The method of claim 1 wherein said composite is a plastic flat-pack package.