Multiple field of view calibration plate having a reqular array of features for use in semiconductor manufacturing

• US 5,825,483 A
• Filed: 12/19/1995
• Issued: 10/20/1998
• Est. Priority Date: 12/19/1995
• Status: Expired due to Term

• Current Assignee: Cognex Corporation, Russ Weinzimmer
• Original Assignee: Cognex Corporation
• Inventors: Michael, David, Wallack, Aaron
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): STAFIRA, MICHAEL PATRICK
• Application Number:
  US08/574,666
• Time in Patent Office: 1,036 Days
• Field of Search: 356/243, 356/237, 356/394, 356/398, 356/384, 356/387, 356/400, 356/401, 356/73, 250/560, 250/572, 250/252.1, 445/3, 445/30, 445/4, 445/64, 445/68, 358/101, 358/107, 33/286, 33/293, 29/574, 29/583, 29/148, 29/DIG. 102, 364/559
• US Class Current: 356/243.1
• CPC Class Codes: G01B 11/002 for measuring two or more coordinates
• CPC Class Codes: G01B 11/245 using a plurality of fixed, simultaneously operating transducers G01B11/2408 - G01B11/2425, G01B11/255 take precedence
• CPC Class Codes: G01N 21/8806 Specially adapted optical and illumination features
• CPC Class Codes: G03F 7/706 Aberration measurement
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775

Abstract

A multiple field of view calibration plate is provided both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining the distance between features on a semiconductor wafer, each feature being disposed within a different field of view, and for correcting image distortion within each field of view. The multiple field of view calibration plate is particularly suited for use in semiconductor manufacturing, and includes a substantially rigid dimensionally-stable substrate having a systematic array of features that are sized such that more than one of the features can fit within a field of view. The array is of a spatial extent such that more than one of the fields of view are substantially filled with the features. Also, the systematic assay of features is characterized by a distribution density suitable for correcting image distortion within a field of view. The systematic array can be a regular array, each feature being separated from each nearest neighboring feature by an equal distance. Alternatively, the separation between neighboring features is a function of position on the substrate, so that given the relative location of two neighboring features, their position on the substrate can be deduced In addition, the substrate includes more than one landmark, each landmark being located at one of a plurality of possible camera positions, where the possible camera positions are of known relative position, so as to facilitate determining the distance between features each disposed within a different field of view.

Claims

1. An article of manufacture both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining the distance between features of a semiconductor wafer each disposed within a different field of view, and for correcting image distortion in each field of view, the article comprising:

a substantially rigid dimensionally-stable substrate having a regular array of features, said features being sized such that a plurality of said features can fit within a field of view, said array being of a spatial extent such that a plurality of fields of view are substantially filled with said features, and said regular array of features being characterized by a distribution density suitable for correcting image distortion within a field of view; and

a plurality of landmarks disposed at a plurality of possible camera positions, said possible camera positions being of known relative position, so as to facilitate determining the distance between features on a semiconductor wafer, each feature disposed within a different field of view.

2. The article of claim 1 wherein said substrate includes markings that communicate relative displacement information regarding at least the linear displacement of each said landmark with respect to each other said landmark.

3. The article of claim 1 wherein said substrate includes markings that communicate relative displacement information regarding both the linear displacement and relative angular displacement of each said landmark with respect to each other said landmark.