Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger

• US 5,825,621 A
• Filed: 08/22/1997
• Issued: 10/20/1998
• Est. Priority Date: 06/12/1997
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Giannatto, Carl J., Cornish, Kevin C.
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US08/916,470
• Time in Patent Office: 424 Days
• Field of Search: 165/139, 165/149, 165/80.3, 165/122, 165/185, 165/104.33, 165/80.4, 165/80.5, 257/706, 257/707, 257/712, 257/713, 257/722, 62/259.2, 174/16.1, 174/16.3, 361/692-695, 361/699, 361/796, 361/831, 361/701-704, 361/707-711, 361/715-719, 361/720-722
• US Class Current: 361/701
• CPC Class Codes: H05K 7/1424 Card cages
• CPC Class Codes: H05K 7/202 Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers

Abstract

A sealed housing for cooling a plurality of printed circuit cards includes a chassis that supports a plurality of electrical connectors retaining printed circuit cards in mutually adjacent, spatially separated relationship. A first side of a respective printed circuit card is attached to an associated convectively cooled heat exchanger, having a cooling fluid flow chamber containing thermally conductive heat exchange elements through which an internal cooling fluid flows. A sealed, forced cooling fluid recirculation structure is mounted to the chassis and recirculates cooling fluid through heat exchangers of respective printed circuit cards. The sealed, internal cooling fluid recirculation structure contains thermally conductive heat exchangers that are convectively coupled with the internal cooling fluid and are conductively coupled to a distribution of thermally conductive fins on the outside of the chassis.

Claims

1. A sealed housing enclosure for securely retaining and cooling a plurality of printed circuit boards comprising:

a chassis having a cavity between sidewalls that contain a plurality of card-guide slots, and receive and guide edges of said printed circuit boards for insertion into electrical connectors at a first portion of said chassis, so that said printed circuit boards are retained in said chassis;

an internal cooling fluid supply/exhaust plenum at a second portion of said chassis spaced apart from said first portion thereof by said cavity therebetween, and including an internal cooling fluid supply chamber, to which an internal cooling fluid for cooling circuit components of said printed circuit boards is supplied, said internal cooling fluid supply chamber having a plurality of internal cooling fluid supply slots, and an internal cooling fluid exhaust chamber adjacent to said internal cooling fluid supply chamber and from which said internal cooling fluid having cooled said circuit components of said printed circuit boards is removed, said internal cooling fluid exhaust chamber having a plurality of internal cooling fluid removal slots adjacent to said plurality of internal cooling fluid supply slots;

a plurality of first thermally conductive heat exchangers, a respective first thermally conductive heat exchanger of said plurality of first thermally conductive heat exchangers being in thermally conductive engagement with a first side of a respective printed circuit board of said plurality of circuit boards, so as to draw heat away from and thereby cool said circuit components mounted to a second side of said respective printed circuit board, and includes an internal cooling fluid inlet port at a first side of said first thermally conductive heat exchanger, and being joined in sealing engagement with a respective internal cooling fluid supply slot of said plurality of internal cooling fluid supply slots of said internal cooling fluid supply chamber of said internal cooling fluid supply/exhaust plenum, and through which said internal cooling fluid is introduced from said internal cooling fluid supply/exhaust plenum, and an internal cooling fluid outlet port adjacent to said internal cooling fluid inlet port at said first side of said first thermally conductive heat exchanger, and joined in sealing engagement with a respective internal cooling fluid removal slot of said plurality of internal cooling fluid removal slots of said internal cooling fluid exhaust chamber of said internal cooling fluid supply/exhaust plenum, and through which said internal cooling fluid is exhausted from said first thermally conductive heat exchanger into said internal cooling fluid supply/exhaust plenum;

a plurality of second thermally conductive heat exchangers mounted externally of said chassis and over which an external cooling fluid external of said housing passes; and

a sealed, internal cooling fluid recirculation structure coupled with said internal cooling fluid supply/exhaust plenum, and containing third thermally conductive heat exchangers that are convectively coupled with said internal cooling fluid and are conductively coupled to said second thermally conductive heat exchangers supported externally of said chassis, said sealed, internal cooling fluid recirculation structure recirculating said internal cooling fluid through said internal cooling fluid supply/exhaust plenum, and thereby through said internal cooling fluid flow chambers of said first thermally conductive heat exchangers of said printed circuit cards, so that said internal cooling fluid is cooled by said second thermally conductive heat exchangers supported externally of said chassis.

2. A sealed housing enclosure according to claim 1, wherein said sealed, internal cooling fluid recirculation structure includes a fan arrangement that is operative to force said internal cooling fluid through said internal cooling fluid supply/exhaust plenum, and thereby through said internal cooling fluid flow chambers of said first thermally conductive heat exchangers of said printed circuit cards and in an internal cooling fluid flow path with said third thermally conductive heat exchangers that are conductively coupled to said second thermally conductive heat exchangers.

3. A sealed housing structure according to claim 2, wherein said internal cooling fluid supply/exhaust plenum is mounted at a top portion of said chassis, and wherein said sealed, internal cooling fluid recirculation structure includes sidewall chambers, which contain fourth thermal heat exchangers therein coupled in fluid communication with said internal cooling fluid supply/exhaust plenum, and are thermally coupled with external sidewall heat exchangers at sidewalls of said chassis.

4. A sealed housing enclosure according to claim 3, further including an end panel and a back cover adjacent to said fan arrangement, said back cover including a distribution of additional thermally conductive heat exchangers projecting from an outer surface thereof, and facilitating cooling of said internal cooling fluid as said internal cooling fluid is recirculated by said fan arrangement.

5. A sealed housing enclosure according to claim 1, wherein said respective first thermally conductive heat exchanger further includes a frame having a first end wall adjoining said fluid supply/exhaust plenum and containing said internal cooling fluid inlet port and said internal cooling fluid outlet port, side walls parallel with side edges of said printed circuit cards, a second end wall opposite to said first end wall, and a back wall, that enclose first and second adjacent internal cooling fluid flow chambers, and a further wall that extends from said first end wall to a location spaced apart from said second end wall, so as to provide an intra chamber fluid communication port connecting said first and second internal cooling fluid flow chambers, and a heat exchanger cover plate, and wherein said heat exchanger further includes first and second thermally conductive heat exchange elements, respectively retained in and substantially filling said first and second internal cooling fluid flow chambers, but leaving a fluid circulation region therein that provides a fluid flow loop path for internal cooling fluid that has entered said first chamber via said internal cooling fluid inlet port in said first end wall of said frame, and has traveled through said first heat exchange element and, upon exiting said first heat exchange element, travels through said fluid circulation region and said second heat exchange element in said second chamber, exiting through said internal cooling fluid exhaust port in said first end wall of said frame.

6. A sealed housing enclosure according to claim 1, further including gasket material that seals interfaces between said internal cooling fluid supply and removal slots of said supply/exhaust plenum and said internal cooling fluid inlet and exhaust ports, respectively, of said first thermally conductive heat exchangers.

7. A sealed housing enclosure according to claim 1, wherein said internal fluid supply/exhaust plenum includes convective heat exchangers that are thermally coupled to further heat exchanger elements on the external surface of said chassis.