Method of cooling electronic devices using a tube in plate heat sink

• US 5,826,643 A
• Filed: 06/07/1996
• Issued: 10/27/1998
• Est. Priority Date: 06/07/1996
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Schmidt, Roger Ray, Galyon, George Tipton, Kemink, Randall Gail
• Primary Examiner(s): Flanigan, Allen J.
• Application Number:
  US08/660,248
• Time in Patent Office: 872 Days
• Field of Search: 165/80.4, 165/168, 165/171, 165/146, 361/699, 361/702, 361/716, 361/719, 361/720, 361/721
• US Class Current: 165/80.4
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.

Claims

1. A method for cooling electronic devices in an electronic assembly, said assembly having at least one board housing electronic modules, steps of which comprises:

shaping a light weight plate as to compliment the geometric arrangement of said board having said modules;

providing channels selectively in said plate at locations where said board and modules require maximum heat dissipation;

placing a plurality of heat dissipator coolant passage tubes in said channels, said coolant passage tubes being of a different material than said plate;

shaping said plate specifically to cater to height and size configurations of all modules in a manner so that the underside surface of said plate in contact with any modules has a step like structure;

cooling said electronic assembly through thermal contact between a coolant provided in said passage tubes and said electronic assembly.

2. The method of claim 1, further comprising the step of selecting a special material for said light weight plate so that said plate functions as a substrate for said coolant passage tubes, and also provides sufficient rigidity to which said module and board assembly can be mounted.

3. The method of claim 1, wherein said coolant passage tubes are completely imbedded in said plate.

4. The method of claim 1, wherein the step of shaping said plate further comprises making said plate thicker on one side and thinner on an opposing side.

5. The method of claim 4, wherein said plate is made to lock wedge shaped.

6. The method of claim 1, further comprising making said plate out of aluminum.

7. The method of claim 1, further comprising making said coolant passages out of copper and shaping said coolant passage tubes so that said passages have thin walls.

8. The method of claim 1, further comprising affixing said coolant passages to said plate.

9. The method of claim 1, wherein said coolant is water.

10. A method of cooling electronic components in an electronic assembly having a plurality of modules, said assembly having a center and a periphery area, comprising the steps:

shaping a light weight plate having channels so that said plate becomes thicker at one end and thinner on a second end;

placing a plurality of thin coolant passage tubes in said channels of said plate, said passage tubes being of a different material than said plate;

affixing said coolant passages to said plate;

placing said plate and coolant passages in thermal contact with said electronic assembly and modules;

configuring said plate and coolant passages in a manner so that said thinner side of said plate faces said center of said assembly and said thicker side is placed along said periphery area of said assembly to maximize heat dissipation of said assembly; and

cooling said electronic assembly by putting said plate and passage tubes in thermal contact with said assembly after a coolant is also provided in said passages.

11. The method of claim 10 further comprising the step providing a coolant in said coolant passages.

12. The method of claim 10, further comprising the step providing water as a coolant in said coolant passages.

13. The method of claim 10, further comprising forming said plate out of aluminum.

14. The method of claim 13, further comprising forming said coolant passages out of copper.

15. The method of claim 14, further comprising shaping said copper coolant passages into thin walled cylindrical tubes having hollow centers for coolant flow.

16. The method of claim 14, further comprising shaping said plate so that said plate is wedge shaped with one end being thinner than an opposing end.

17. The method of claim 10, further comprising the step of providing an interface material between said plate and said modules.

18. The method of claim 14, wherein said coolant passage tubes are affixed to said plate by soldering said copper tubing to said aluminum plate.

19. The method of claim 10, further comprising shaping said plate in a manner as to provide for a shape transformation from top surfaces of the modules to said coolant passages, and further shaping geometry of said plate as to provide a complimentary fit when affixed to said electronic assembly, said plate being thicker or thinner in selective areas where there is a height difference in said modules mounted on said assembly.

20. The method of claim 19, further comprising the step providing water as a coolant in said coolant passage tubes.

21. The method of claim 20, further comprising forming said plate out of aluminum.

22. The method of claim 21, further comprising forming said coolant passage tubes out of copper.

23. A method of cooling electronic elements and modules in an electronic assembly using a heat sink, said method comprising the steps:

forming a wedge shaped plate out of aluminum in a manner so that one end of said plate is substantially thinner than an opposing end;

providing a plurality of substantially semi-cylindrical channels through out said plate so that said channels are visible from a side adjacent to any of said ends of said plate;

forming a plurality of thin walled cylindrical shaped copper water passage tubes;

placing said copper coolant passage tubes in said channels of said plate;

affixing said copper coolant passage tubes to said aluminum plate;

shaping said copper coolant passage tubes so any areas exposed visibly become flushed with said surface of said aluminum plate;

affixing said plate assembly to said electronic assembly in a manner so that said coolant assembly becomes independent and can function in any orientation that said electronic assembly may be placed in; and

cooling said electronic assembly by placing said plate and passages in thermal contact with said assembly after water is introduced as a coolant into said passage tubes.

25. The method of claim 23, wherein said coolant passage tubes are affixed to said plate by means of soldering said copper tubing to said aluminum plate.

26. The method of claim 23, further comprising the step of providing an interface material between said plate and said modules.

27. The method of claim 26, wherein said interface material is grease.

24. A method of water cooling electronic elements and modules in an electronic assembly, said method comprising the steps:

forming a wedge shaped plate out of aluminum in a manner so that one end of said plate is substantially thinner than an opposing end;

further shaping said aluminum plate in a manner as to provide for a shape transformation from top surfaces of the modules to said coolant passage tubes, so that geometry of said plate compliments geometry of said electronic assembly, said plate being accommodating to said assembly where any height difference in said modules are taken into consideration to provide a fit;

providing a plurality of substantially semi-cylindrical channels through out said plate so that said channels are visible from a side adjacent to any of said ends of said plate;

forming a plurality of thin walled cylindrical shaped copper water passage tubes;

placing said copper water passage tubes in said channels of said plate;

affixing said copper water passage tubes to said aluminum plate;

shaping said copper water passage tubes so any areas exposed visibly become flushed with said surface of said aluminum plate;

providing water flow in said water passage tubes;

affixing said plate assembly to said electronic assembly in a manner so that said coolant assembly becomes independent and can function in any orientation that said electronic assembly may be placed in.