Electrically modulatable thermal radiant source with specific filament

• US 5,827,438 A
• Filed: 11/22/1996
• Issued: 10/27/1998
• Est. Priority Date: 11/24/1995
• Status: Expired due to Term

• Current Assignee: Vaisala OY
• Original Assignee: Vaisala OY
• Inventors: Lindblad, Stefan, Lehto, Ari, Blomberg, Martti, Torkkeli, Altti
• Primary Examiner(s): O'Shea, Sandra L.
• Assistant Examiner(s): Gerike, Matthew J.
• Application Number:
  US08/754,128
• Time in Patent Office: 704 Days
• Field of Search: 313/578, 313/15, 313/325, 392/407, 219/543, 219/544
• US Class Current: 219/544
• CPC Class Codes: G01J 3/108 for measurement in the infrared range
• CPC Class Codes: H01K 1/00 Details
• CPC Class Codes: H01K 7/00 Lamps for purposes other than general lighting H01K9/00 - H01K13/00 take precedence
• CPC Class Codes: H05B 3/12 characterised by the composition or nature of the conductive material
• CPC Class Codes: H05B 3/16 the conductor being mounted on an insulating base

Abstract

The invention is related to an electrically modulatable thermal radiant source with a multilayer structure. The radiant source includes a substrate, a first insulating layer formed onto the substrate, a radiant surface layer formed onto the first insulating layer, a second insulating layer formed on the radiant surface layer, a first metallization (incandescent filament) layer formed on the second insulating layer, a third insulating layer formed on the first metallization layer, and a second metallization layer for contacting formed on the third insulating layer. According to the invention, very thin incandescent filaments are formed from the first metallization layer and surrounded by the other elements of the multilayer structure as a uniform, planar plate.

Claims

1. An electrically modulatable thermal radiant source with a multilayer structure comprising:

a substrate,

a first insulating layer formed onto said substrate,

a radiant surface layer formed onto said first insulating layer,

a second insulating layer formed on said radiant surface layer,

a first metallization layer formed on said second insulating layer,

a third insulating layer formed on said first metallization layer,

a second metallization layer for contacting formed on said third insulating layer,

wherein said first metallization layer forms a planar plate of thin, incandescent filaments, said incandescent filaments being surrounded by said first insulating layer, said radiant layer, said second insulating layer, and said third insulating layer and said incandescent filaments being spaced from each other over an area of said planar plate, a spacing between adjacent incandescent filaments near edges of said planar plate of incandescent filaments being closer than a spacing between adjacent incandescent filaments near a midportion of said planar plate of incandescent filaments.

2. A radiant source as defined in claim 1, characterized in that into said substrate is etched an opening at said radiant surface layer.

3. A radiant source as defined in claim 1, characterized in that said first insulating layer is made of silicon nitride, silicon dioxide or aluminum oxide.

4. A radiant source as defined in claim 1, characterized in that said second insulating layer is made of silicon nitride, silicon dioxide or aluminium oxide.

5. A radiant source as defined in claim 1, characterized in that said radiant surface layer is made of polycrystalline silicon.

6. A radiant source as defined in claim 5, characterized in that said radiant surface layer is made of doped polycrystalline silicon.

7. A radiant source as defined in claim 1, characterized in that said first metallization layer is made of tungsten, titanium-tungsten alloy, tantalum or molybdenum.

8. A radiant source as defined in claim 1, characterized in that said third insulating layer is made of silicon nitride, silicon dioxide or aluminium oxide.

9. A radiant source as defined in claim 1, characterized in that said incandescent filaments permit said radiant surface layer to act as the primary source of thermal radiation.

10. A radiant source as defined in claim 1, characterized in that the overall optical thickness of said insulating and radiant layers is λ

/2 or an integral multiple thereof at a desired wavelength.

11. A radiant source as defined in claim 1, characterized in that individual ones of said incandescent filaments are electrically connected in parallel.

12. A radiant source as defined in claim 1, characterized in that individual ones of said incandescent filaments are electrically connected in series.

13. A radiant source as defined in claim 1, characterized in that individual ones of said individual incandescent filaments are electrically connected in a parallel-series configuration.

14. A radiant source as defined in claim 1, characterized in that individual ones of said incandescent filaments are tapered toward their ends.

15. A radiant source as defined in claim 1, characterized in that said radiant source incorporates means for internal temperature measurement.

16. A radiant source as defined in claim 1, characterized in that said radiant source incorporates at least one pressure-equalizing opening.

17. A radiant source as defined in claim 1, characterized in that the width of said incandescent filaments is approximately 2-10 μ

m with a thickness of approximately 0.1-1 μ

m.

18. A radiant source as defined in claim 1, characterized in that said substrate is made of silicon.

19. A radiant source as defined in claim 18, characterized in that into said silicon substrate is etched an opening at said radiant surface layer.

20. A radiant source as defined in claim 17, characterized in that the spacing between adjacent incandescent filament near a midportion of said planar plate of incandescent filaments is approximately 20-50 μ

m.