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High pressure sensor apparatus with low cost compact packaging system

  • US 5,827,972 A
  • Filed: 11/02/1993
  • Issued: 10/27/1998
  • Est. Priority Date: 11/02/1993
  • Status: Expired due to Term
First Claim
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1. A pressure sensor comprising:

  • a metallic housing having a bottom wall formed with a fluid pressure inlet in the bottom wall and having a sidewall extending upwardly from the bottom wall to a distal end,a pressure sensing module having a pressure responsive surface communicating with the fluid pressure inlet and disposed within the housing closely adjacent the upwardly extending sidewall, the upwardly extending sidewall circumscribing the pressure sensing module,an annular stop surface integrally formed as part of the bottom wall, the stop surface disposed a selected first distance above the remainder of the bottom wall, the pressure sensing module received on the stop surface,a seal formed of resilient material received on the bottom wall contiguous to and inboard of the stop surface, the seal formed of resilient material having a height of a second distance greater than the first distance whereby compression of the seal by the pressure sensing module is limited by the stop surface,the distal end of the upwardly extending sidewall being crimped inwardly to place a force on the pressure sensing module biasing the module against the stop surface, anda connector attached to the housing to provide electrical connection to the pressure sensing module.

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