Semiconductor device with bonded wires

• US 5,828,116 A
• Filed: 01/21/1997
• Issued: 10/27/1998
• Est. Priority Date: 01/22/1996
• Status: Expired due to Term

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ao, Kenichi
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US08/786,764
• Time in Patent Office: 644 Days
• Field of Search: 257/417, 257/418, 257/420, 257/783, 257/786, 257/784, 257/735, 257/736, 257/695, 257/692, 73/514.33, 73/514.34, 73/720, 73/721, 73/726, 73/727
• US Class Current: 257/417
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48455 Details of wedge bonds
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/48744 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49173 Radial fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78313 Wedge
• CPC Class Codes: H01L 2224/78318 inside the capillary
• CPC Class Codes: H01L 2224/85148 : involving movement of a part of the bonding apparatus
• CPC Class Codes: H01L 2224/85203 : Thermocompression bonding
• CPC Class Codes: H01L 2224/85206 : Direction of oscillation
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

The present invention provides an improved method of wire-bonding on a semiconductor chip, especially a small acceleration sensor chip which is mounted on a substrate with an adhesive having low stress characteristics such as a silicon resin. Further, the present invention provides a semiconductor device having a structure in which the improved method of wire bonding is easily applicable. The wire-bonding is performed by giving ultrasonic vibrations to the wires and the pads on which the wires are bonded while imposing pressure thereon. The vibration is given in a direction along a radial line extending from the center of the semiconductor chip.

Claims

1. A semiconductor device comprising:

a substrate;

a semiconductor chip having bonding pads thereon, the semiconductor chip being mounted on the substrate with an adhesive; and

wires bonded to the bonding pads, each wire having a bonded portion that has a shape elongated substantially along a line extending radially from a center of the semiconductor chip.

2. The semiconductor device according to claim 1, wherein:

the semiconductor chip includes thin bridge portions which are not in contact with the substrate, and

each thin bridge portion has a strain gage formed thereon.

3. The semiconductor device according to claim 1 or 2, wherein:

the adhesive is a material made of silicon resin.

4. The semiconductor device according to claim 1 or 2, wherein:

an upper surface of the semiconductor chip and an upper surface of the substrate are substantially at the same level.

5. The semiconductor device according to claim 3, wherein:

an upper surface of the semiconductor chip and an upper surface of the substrate are substantially at the same level.

6. The semiconductor device according to claim 1 or 2, wherein:

the substrate is made of ceramics.

7. The semiconductor device according to claim 1 or 2, further comprising:

an integrated circuit chip,

wherein the bonded wires are connected to the integrated circuit chip.

8. The semiconductor device according to claim 1, wherein:

the bonded portion of each wire is formed by applying ultrasonic vibrations to the wire in a direction along the radially extending line.

9. The semiconductor device according to claim 1, wherein:

each wire extends substantially in a radial direction.