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Methods and apparatus for sputtering with rotating magnet sputter sources

  • US 5,830,327 A
  • Filed: 10/02/1996
  • Issued: 11/03/1998
  • Est. Priority Date: 10/02/1996
  • Status: Expired due to Fees
First Claim
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1. A magnetron sputtering source for forming a sputtered film on a substrate in a magnetron sputtering apparatus, comprising:

  • a target having a surface from which material is sputtered; and

    a magnet assembly consisting of an array of single magnet bars that is rotatable about an axis of rotation with respect to said target, said magnet assembly producing on said target an erosion profile that approximates a solution to an equation of the form ##EQU9## where e(r'"'"') is the erosion profile, t(r) is a desired radial thickness distribution of the sputtered film, K(r,r'"'"') is a function depending on the sputter geometry and process conditions, r is the radial position on the substrate, r'"'"' is the radial position on the target, and a and b are the radial limits of erosion on the target.

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