Copper wire

• US 5,830,583 A
• Filed: 02/03/1997
• Issued: 11/03/1998
• Est. Priority Date: 04/19/1993
• Status: Expired due to Fees

• Current Assignee: Gould Electronics Incorporated (Eternal Materials Co., Ltd.)
• Original Assignee: Apperson R. Duane, Bernd Schneider, Robert J. Fedor, Roger N. Wright, Rudolf Wiechmann, Sharon K. Young, Sidney J. Clouser, Stephen J. Kohut, Susan S. Enos, Ulrike Bohmler
• Inventors: Schneider, Bernd, Young, Sharon K., Clouser, Sidney J., Fedor, Robert J., Enos, Susan S., Bohmler, Ulrike, Apperson, R. Duane, Wiechmann, Rudolf, Wright, Roger N., Kohut, Stephen J.
• Primary Examiner(s): Zimmerman, John J.
• Application Number:
  US08/792,795
• Time in Patent Office: 638 Days
• Field of Search: 428/606, 428/935, 148/432
• US Class Current: 428/606
• CPC Class Codes: C25D 1/04 Wires; Strips; Foils
• CPC Class Codes: Y10S 428/935 Electroplating
• CPC Class Codes: Y10T 428/12431 Foil or filament smaller than 6 mils

Abstract

This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177° C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

Claims

1. A copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free, said wire being made from electrodeposited copper foil and having an ultimate tensile strength at 23°

C. in the range of about 60,000 psi to about 95,000 psi.

2. The wire of claim 1 wherein said wire has a grain structure that is essentially twin boundary free and substantially porosity free.

3. The wire of claim 1 wherein said wire has grain structure with an average grain size of up to about 8 microns.

4. The wire of claim 1 wherein said wire has an elongation at 23°

C. in the range of about 8% to about 18%.

5. The wire of claim 1 wherein said wire has an ultimate tensile at 180°

C. in the range of about 22,000 to about 32,000 psi and an elongation at 180°

C. in the range of about 24% to about 45%.

6. The wire of claim 1 wherein said wire has a round cross-sectional shape.

7. The wire of claim 1 wherein said wire has a square or rectangular cross-sectional shape.

8. The wire of claim 1 wherein said wire has a cross-sectional shape in the form of a cross, star, semi-circle, polygon, race track, oval, flat or ribbed-flat.