Silicon micromachined motion sensor and method of making

• US 5,831,162 A
• Filed: 01/21/1997
• Issued: 11/03/1998
• Est. Priority Date: 01/21/1997
• Status: Expired due to Term

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Chilcott, Dan Wesley, Jiang, George Qin, Sparks, Douglas Ray, Kearney, Mark Billings
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US08/785,683
• Time in Patent Office: 651 Days
• Field of Search: 73/493, 73/504.13, 73/504.12, 73/504.02, 73/431, 216/2, 216/18, 216/79, 437/225, 437/927, 437/921, 437/974
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/5684 the devices involving a micromechanical structure
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details

Abstract

A method for making and vacuum packaging a silicon micromachined motion sensor, such as a gyroscope, at the chip level. The method involves micromachining a trench-isolated sensing element in a sensing chip, and then attaching a circuit chip to enclose the sensing element. Solder bumps serve to attach the circuit chip to the sensing chip, form a hermetic seal to enable vacuum-packaging of the sensor, and electrically interconnect the sensing chip with the circuit chip. Conductive runners formed on the enclosed surface of the circuit chip serve to electrically interconnect the sensing element with its associated sensing structures.

Claims

1. A motion sensor comprising:

a sensing chip having a micromachined sensing element with an axis of rotation;

electrodes on the sensing chip and forming an electrode pattern that circumscribes the sensing element;

a trench in the sensing chip so as to circumscribe the sensing element and thereby physically isolate the sensing element from the electrodes;

a first contact on the sensing chip and electrically connected to the sensing element;

a circuit chip attached to the sensing chip so as to form an enclosure for the sensing element between the circuit chip and the sensing chip, the circuit chip having an integrated circuit;

a second contact on the circuit chip and within the enclosure, the second contact being registered with the first contact so as to be electrically connected to the first contact;

a third contact on the circuit chip and within the enclosure, the third contact being registered with one of the electrodes so as to be electrically connected thereto; and

conductive runners on the circuit chip and electrically connecting the second and third contacts to the integrated circuit.

2. A motion sensor as recited in claim 1 further comprising a seal circumscribing the electrode pattern so as to hermetically enclose the sensing element between the circuit chip and the sensing chip.

3. A motion sensor as recited in claim 2 wherein the seal is formed by solder.

4. A motion sensor as recited in claim 1 further comprising a plurality of contacts on the circuit chip and electrically connected to the electrodes.

5. A motion sensor as recited in claim 1 wherein the first contact is formed on the sensing element.

6. A motion sensor as recited in claim 1 wherein the first contact is physically spaced apart from the sensing element on the sensing chip, the motion sensor further comprising an electrical conductor electrically connecting the sensing element to the first contact.

7. A motion sensor as recited in claim 1 further comprising a cavity formed in the sensing chip beneath the sensing element so as to space the sensing element from the sensing chip in a direction parallel to the axis of rotation of the sensing element.

8. A motion sensor as recited in claim 1 further comprising a cavity formed in the sensing element such that the sensing element has a tubular shape.

9. A motion sensor as recited in claim 1 further comprising a post supporting the sensing element on the sensing chip, the sensing element comprising a plurality of spring members extending radially from the post, and a ring circumscribing the spring members and supported by the spring members.

10. A motion sensor as recited in claim 1 wherein the trench is formed on the sensing chip so as to surround each of the electrodes, whereby the electrodes are physically and electrically isolated from each other by the trench.

11. A motion sensor comprising:

a sensing chip having a surface;

an electrically-conductive micromachined sensing element comprising a post supporting the micromachined sensing element above the surface of the sensing chip, a plurality of spring members extending radially from the post, and a ring circumscribing the spring members and supported by the spring members, the micromachined sensing element having an axis of rotation through the post;

electrodes on the sensing chip and forming an electrode pattern that circumscribes the micromachined sensing element;

at least one trench in the sensing chip and surrounding the electrodes and the micromachined sensing element so as to physically and electrically isolate the electrodes from each other and the micromachined sensing element;

a first contact on the sensing chip and electrically connected to the micromachined sensing element;

a circuit chip attached to the sensing chip so as to enclose the micromachined sensing element between the circuit chip and the sensing chip, the circuit chip having an integrated circuit;

a second contact on the circuit chip and electrically connected to the first contact;

a third contact on the circuit chip and electrically connected to one of the electrodes; and

conductive runners on the circuit chip and electrically connecting the second and third contacts to the integrated circuit.

12. A motion sensor as recited in claim 11 further comprising a seal circumscribing the electrode pattern so as to hermetically enclose the micromachined sensing element between the circuit chip and the sensing chip.

13. A motion sensor as recited in claim 12 wherein the seal is formed by solder.

14. A motion sensor as recited in claim 11 further comprising a plurality of contacts on the circuit chip and electrically connected to the electrodes.

15. A motion sensor as recited in claim 11 wherein the first contact is formed on the micromachined sensing element.

16. A motion sensor as recited in claim 11 wherein the first contact is formed on the surface of the sensing chip between an adjacent pair of the spring members, the motion sensor further comprising an electrical conductor electrically connecting the micromachined sensing element to the first contact.

17. A motion sensor as recited in claim 11 further comprising a cavity formed in the surface of the sensing chip beneath the micromachined sensing element so as to space the micromachined sensing element from the sensing chip in a direction parallel to the axis of rotation of the micromachined sensing element.

18. A motion sensor as recited in claim 11 further comprising a cavity formed in the micromachined sensing element such that the micromachined sensing element has a tubular shape.

19. A motion sensor as recited in claim 11 wherein the at least one trench is a continuous trench that surrounds the electrodes and the micromachined sensing element.

20. A motion sensor as recited in claim 11 wherein the electrodes are adjacently disposed on the sensing chip such that the electrode pattern comprises adjacent pairs of the electrodes, and wherein the at least one trench forms a g-stop between each adjacent pair of the electrodes.

21. A method for forming a motion sensor, the method comprising the steps of:

forming in a sensing chip a micromachined sensing element having an axis of rotation, electrodes that define an electrode pattern that circumscribes the sensing element, a trench that circumscribes the sensing element and thereby physically isolates the sensing element from the electrodes, and a first contact electrically connected to the sensing element;

forming on a circuit chip an integrated circuit, second and third contacts, and conductive runners that electrically connect the second and third contacts to the integrated circuit; and

attaching the circuit chip to the sensing chip so as to enclose the sensing element and the first, second and third contacts between the circuit chip and the sensing chip, electrically connect the second contact with the first contact, and electrically connect the third contact to one of the electrodes.

22. A method as recited in claim 21 wherein the sensing chip comprises a heavily-doped silicon layer overlying a handle layer, the sensing element being etched from the heavily-doped silicon layer.

23. A method as recited in claim 22 wherein the heavily-doped silicon layer is an epitaxial layer.

24. A method as recited in claim 22 wherein the handle layer is formed of a glass material.

25. A method as recited in claim 22 wherein the heavily-doped silicon layer and the handle layer are separate by an oxide layer.

26. A method as recited in claim 22 wherein the heavily-doped silicon layer and the handle layer are formed by first and second wafers that are bonded together.

27. A method as recited in claim 26 further comprising the step of etching a cavity in the handle layer prior to bonding the first and second wafers, the trench that circumscribes the sensing element being contiguous with the cavity after the first and second wafers are bonded together.

28. A method as recited in claim 26 further comprising the step of etching a cavity in the heavily-doped layer prior to bonding the first and second wafers, the cavity being located within the sensing element such that the sensing element has a tubular shape.

29. A method as recited in claim 21 further comprising the step of forming a seal that circumscribes the electrode pattern so as to hermetically enclose the sensing element between the circuit chip and the sensing chip.

30. A method as recited in claim 29 wherein the seal is formed by solder.

31. A method as recited in claim 30 further comprising the step of forming electrical connections with solder between the second contact and the first contact and between the third contact and one of the electrodes.

32. A method as recited in claim 21 further comprising a plurality of contacts on the circuit chip electrically connected to the electrodes.

33. A method as recited in claim 21 wherein the first contact is formed on the sensing element.

34. A method as recited in claim 21 wherein the first contact is formed on the sensing chip so as to be physically spaced apart from the sensing element, the method further comprising the step of forming an electrical conductor that electrically connects the sensing element to the first contact.

35. A method as recited in claim 21 further comprising the step of forming a post that supports the sensing element on the sensing chip, and wherein the sensing element is formed to have a plurality of spring members extending radially from the post, and a ring circumscribing the spring members and supported by the spring members.

36. A method as recited in claim 21 wherein the trench is formed on the sensing chip so as to surround each of the electrodes, whereby the electrodes are physically and electrically isolated from each other by the trench.