Power supply apparatus

• US 5,831,240 A
• Filed: 11/07/1995
• Issued: 11/03/1998
• Est. Priority Date: 11/08/1994
• Status: Expired due to Term

• Current Assignee: Sansha Electric Manufacturing Company Limited
• Original Assignee: Sansha Electric Manufacturing Company Limited
• Inventors: Arai, Toru, Danjo, Kenzo, Katooka, Masao, Tanaka, Masaharu, Okamoto, Shigeru
• Primary Examiner(s): Shaw, Clifford C.
• Application Number:
  US08/554,529
• Time in Patent Office: 1,092 Days
• Field of Search: 219/130.1, 219/130.51, 361/600, 361/695, 361/699, 363/141
• US Class Current: 219/130.1
• CPC Class Codes: B23K 9/323 Combined coupling means, e.g. gas, electricity, water or the like electrical only H01R

Abstract

A power supply apparatus includes first and second spaced-apart, substantially parallel panels, and a chassis disposed in substantially perpendicular to and between the first and second panels. Opposite edges of the chassis are coupled to the respective ones of the first and second panels to thereby partition the space between the first and second panels into upper and lower regions. A power supply circuit includes heat-generating electric components disposed in the lower region, and non-heat-generating components disposed in the upper region. The chassis has an opening therein and a heat sink is mounted to close the opening in the chassis. A semiconductor module of the power supply circuit is mounted on the surface facing to the upper region of the heat sink.

Claims

1. A power supply apparatus comprising:

first and second spaced, substantially parallel panels;

a partition disposed substantially perpendicular to and between said first and second panels and having its two opposed edges coupled to respective ones of said first and second panels at locations thereon intermediate between the top and bottom edges of said first and second panels to thereby form an H-shaped structure with said first and second panels, said partition dividing the space between said first and second panels into first and second regions; and

a power supply including a first heat-generating electric component disposed in said first region, and an electric component disposed in said second region and generating a smaller amount of heat than said first heat-generating electric component.

2. The power supply apparatus according to claim 1 wherein said first and second panels have substantially the same shape.

3. The power supply apparatus according to claim 1, wherein there are further provided third and fourth panels of substantially the same shape, each of said third and fourth panels having a generally U-shaped cross-section, the tip ends of the legs of one of said U-shaped panels abutting against the tip of the corresponding legs of the other U-shaped panel to thereby form a rectangular tubular casing, the open ends of said rectangular tubular casing being closed by said first and second panels, whereby a housing is formed.

4. The power supply apparatus according to claim 1 wherein:

said partitioning means includes an opening therein through which said first and second regions are in communication with each other;

heat sink means is disposed in said first region to substantially cover said opening in said partitioning means; and

a second heat-generating electric component is mounted on said heat sink means.

5. The power supply apparatus according to claim 4 wherein:

said second heat-generating electric component includes a semiconductor module including therein power semiconductor switching means for high-frequency switching of DC power; and

said semiconductor module is mounted on said heat sink means in such a manner as to be located in said second region.

6. The power supply apparatus according to claim 5, wherein:

said electric component generating a smaller amount of heat includes a component to be electrically connected to said semiconductor module, said component to be electrically connected to said semiconductor module being disposed in the vicinity of said semiconductor module.

7. The power supply apparatus according to claim 6 wherein:

said component to be electrically connected to said semiconductor module is disposed on a printed circuit board;

said printed circuit board includes terminal fixing means to be electrically connected to said component, and a through-hole formed therein in the vicinity of said terminal fixing means; and

said semiconductor module includes a terminal to be inserted into said through-hole in said printed circuit board and fixed by means of said terminal fixing means.

8. The power supply apparatus according to claim 1 wherein said first and second panels and said partitioning means are joined together by means first engaging means disposed on said first and second panels and second engaging means disposed on said partitioning means to engage with said first engaging means.

9. A power supply apparatus comprising:

a casing including first and second spaced, substantially parallel panels;

a partition disposed substantially perpendicular to and between said first and second panels, and having its two opposed edges coupled to respective ones of said first and second panels to thereby divide the space between said first and second panels into first and second regions;

said second panel having a third opening at a location corresponding to said first region for making said first region communicate with the exterior;

said partition including a fourth opening for making said first and second regions communicate with each other;

a power supply including a heat-generating electric component disposed substantially in said first region, and an electric component disposed in said second region and generating a small amount of heat; and

a single air-blower disposed in said first region for making air flow between said first and third openings, and between said second and third openings via said fourth opening.

10. The power supply apparatus according to claim 9 wherein a plurality of heat-generating components are arranged in order from a location near said first opening toward said third opening.

11. The power supply apparatus according to claim 9 wherein:

heat sink means is disposed in the first region side of said fourth opening with a spacing disposed therebetween;

said heat-generating components include DC-to-AC converting means for converting DC power to AC power, voltage-lowering means for lowering the output voltage of said converting means, and AC-to-DC converting means for converting the output power of said voltage-lowering means to DC power; and

said DC-to-AC converting means is mounted on said heat sink means on its fourth opening side.

12. A power supply apparatus, comprising:

input-side AC-to-DC converting means including input-side rectifying means and first smoothing means, for converting AC power to DC power;

inverter means including a plurality of semiconductor switching devices and a plurality of flywheel diodes each connected in parallel with a respective one of said semiconductor switching devices, for converting said DC power to high-frequency power; and

output-side AC-to-DC converting means including output-side rectifying means and second smoothing means, for converting said high-frequency power to DC power;

said input-side rectifying means, said semiconductor switching devices, said flywheel diodes, and said output-side rectifying means being included in a single semiconductor module.

13. The power supply apparatus according to claim 12, further comprising:

first and second spaced, substantially parallel panels;

a partition having its two opposed edges coupled to respective ones of said first and second panels at locations thereon intermediate between the top and bottom edges of said first and second panels to thereby form an H-shaped structure with said first and second panels, said partition dividing the space between said first and second panels into first and second regions, said partition including an opening through which said first and second regions communicate with each other; and

a heat sink disposed in said first region and mounted to said opening in said partition to thereby cover said opening;

said semiconductor module being mounted on said heat sink on the second region side thereof.