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Apparatus for spray-cooling multiple electronic modules

  • US 5,831,824 A
  • Filed: 01/31/1996
  • Issued: 11/03/1998
  • Est. Priority Date: 01/31/1996
  • Status: Expired due to Fees
First Claim
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1. An apparatus for spray-cooling multiple electronic modules, the apparatus comprising:

  • a chassis defining a chamber, the chassis having a first wall and a second wall opposed to the first wall, the first wall having an interior side and an exterior side and the second wall having an interior side and an exterior side;

    a first plurality of guides integrally formed in the interior side of the first wall;

    a second plurality of guides integrally formed in the interior side of the second wall, one of each of the first plurality of guides being in substantial alignment with one of each of the second plurality of guides, to secure the electronic modules therebetween;

    a plurality of substantially planar fluid distributing manifolds integrally formed in the first wall, each fluid distributing manifold having a surface recessed relative to at least a portion of the exterior side of the first wall; and

    a plurality of nozzles integrally formed in the surface of each fluid distributing manifold, each nozzle having a receptacle end and a spray end, the spray end having an aperture, the receptacle end being in communication with the surface of one of the plurality of fluid distributing manifolds and the spray end being in communication with the interior side of the first wall,the receptacle end of each nozzle receiving a fluid from one of the plurality of fluid distributing manifolds, the spray end of each nozzle atomizing the fluid and discharging the atomized fluid through the aperture.

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