Apparatus for spray-cooling multiple electronic modules

• US 5,831,824 A
• Filed: 01/31/1996
• Issued: 11/03/1998
• Est. Priority Date: 01/31/1996
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: McDunn, Kevin J., Limper-Brenner, Linda, Press, Minoo D.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/594,212
• Time in Patent Office: 1,007 Days
• Field of Search: 165/104.33, 165/80.4, 361/687-689, 361/698-703, 361/752, 361/785, 361/796
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20345 Sprayers; Atomizers

Abstract

The apparatus includes a substantially planar plate having a first side and a second side. A plurality of substantially planar fluid distributing manifolds are formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate. A nozzle housing is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end and a spray end. The spray end has an aperture, and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.

Claims

1. An apparatus for spray-cooling multiple electronic modules, the apparatus comprising:

a chassis defining a chamber, the chassis having a first wall and a second wall opposed to the first wall, the first wall having an interior side and an exterior side and the second wall having an interior side and an exterior side;

a first plurality of guides integrally formed in the interior side of the first wall;

a second plurality of guides integrally formed in the interior side of the second wall, one of each of the first plurality of guides being in substantial alignment with one of each of the second plurality of guides, to secure the electronic modules therebetween;

a plurality of substantially planar fluid distributing manifolds integrally formed in the first wall, each fluid distributing manifold having a surface recessed relative to at least a portion of the exterior side of the first wall; and

a plurality of nozzles integrally formed in the surface of each fluid distributing manifold, each nozzle having a receptacle end and a spray end, the spray end having an aperture, the receptacle end being in communication with the surface of one of the plurality of fluid distributing manifolds and the spray end being in communication with the interior side of the first wall,

the receptacle end of each nozzle receiving a fluid from one of the plurality of fluid distributing manifolds, the spray end of each nozzle atomizing the fluid and discharging the atomized fluid through the aperture.

2. The apparatus according to claim 1, further comprising an electronic module, the electronic module secured between one of the first plurality of guides and one of the second plurality of guides.

3. The apparatus according to claim 2, wherein the electronic module comprises a passive component.

4. The apparatus according to claim 2, wherein the electronic module comprises a multi-chip module.

5. The apparatus according to claim 2, wherein the electronic module comprises an electronic hybrid assembly.

6. The apparatus according to claim 1, wherein the second wall has a plurality of orifices.

7. The apparatus according to claim 6, further comprising:

a fluid supply manifold in communication with the exterior side of the first wall, the fluid supply manifold defining a reservoir, the reservoir supplying the fluid to the plurality of fluid distributing manifolds; and

a fluid discharge manifold in communication with the exterior side of the second wall, the fluid discharge manifold collecting the fluid removed by the plurality of orifices.

8. The apparatus according to claim 7, further comprising:

a fluid pump in fluid communication with the fluid supply manifold; and

a condenser in fluid communication with the fluid pump and with the fluid discharge manifold;

the condenser receiving the fluid from the fluid discharge manifold and supplying the fluid to the fluid pump, the fluid pump supplying the fluid to the fluid supply manifold, forming a closed loop fluid supply system.

9. The apparatus according to claim 1, further comprising:

an end plate in communication with the chassis.

10. The apparatus according to claim 1, wherein the chassis comprises plastic.

11. The apparatus according to claim 1, wherein the fluid comprises a perfluorocarbon fluid.

12. The apparatus according to claim 1, wherein the spray end of each of the plurality of nozzles is substantially perpendicular to at least a portion of the surface of each of the plurality of fluid distributing manifolds.

13. The apparatus according to claim 1, wherein the surface of each of the plurality of fluid distributing manifolds comprises a groove.

14. An apparatus for spray-cooling multiple electronic modules, the apparatus comprising:

a substantially planar plate having a first side and a second side;

a plurality of substantially planar fluid distributing manifolds formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate;

a plurality of guides integrally formed in the second side of the plate sized to receive the electronic modules; and

a nozzle housing in the surface of each fluid distributing manifold, the nozzle housing adapted to receive a nozzle and having a receptacle end and a spray end, the spray end having an aperture, the receptacle end being in communication with the surface of one of the plurality of fluid distributing manifolds and the spray end being in communication with the second side of the plate.

15. The apparatus according to claim 14, further comprising a nozzle, the nozzle disposed in the nozzle housing, wherein the nozzle is press-fit into the nozzle housing.

16. The apparatus according to claim 15, wherein the nozzle is soldered into the nozzle housing.

17. The apparatus according to claim 15, wherein the nozzle comprises brass.

18. The apparatus according to claim 14, wherein the plate comprises aluminum.

19. The apparatus according to claim 14, wherein the surface of each of the plurality of fluid distributing manifolds comprises a groove.

20. The apparatus according to claim 14, further comprising:

a fluid supply manifold in sealed communication with the first side of the plate, the fluid supply manifold supplying a fluid to the plurality of fluid distributing manifolds.

21. A method for spray-cooling multiple electronic modules, the method comprising:

providing a substantially planar plate having a first side and a second side, the second side having a plurality of guides integrally formed therein, each of the plurality of guides sized to receive an electronic module;

supplying a fluid to a plurality of substantially planar fluid distributing manifolds formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate;

receiving the fluid by a nozzle located in the surface of each fluid distributing manifold, the nozzle having a spray end and an aperture;

atomizing the fluid by the spray end of the nozzle; and

discharging the atomized fluid through the aperture of the nozzle.