Flexible circuit board and common heat spreader assembly
First Claim
1. A flexible circuit board comprising:
- thicker, multi-layer sections, each with a plurality of wiring layers and a plurality of dielectric layers, selected ones of said thicker sections adapted for having an electronic component secured thereto;
thinner sections with less wiring layers and less dielectric layers than in said thicker sections, said thinner sections capable of being bent in a predetermined manner without bending of said thicker sections; and
a heat sink including a plurality of cavities therein, said thinner and thicker sections adapted for being positioned on said heat sink such that said electronic components are positioned within corresponding ones of said cavities of said heat sink.
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Accused Products
Abstract
A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board. A thermally conductive adhesive or grease connects between the components and the bottoms of the cavities. Two heat sink plates are bolted together and along with other such heat sink plates are bolted to an enclosure frame to improve thermal performance.
58 Citations
15 Claims
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1. A flexible circuit board comprising:
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thicker, multi-layer sections, each with a plurality of wiring layers and a plurality of dielectric layers, selected ones of said thicker sections adapted for having an electronic component secured thereto; thinner sections with less wiring layers and less dielectric layers than in said thicker sections, said thinner sections capable of being bent in a predetermined manner without bending of said thicker sections; and a heat sink including a plurality of cavities therein, said thinner and thicker sections adapted for being positioned on said heat sink such that said electronic components are positioned within corresponding ones of said cavities of said heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification