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Apparatus and method for controlling high throughput sputtering

  • US 5,831,851 A
  • Filed: 03/21/1995
  • Issued: 11/03/1998
  • Est. Priority Date: 03/21/1995
  • Status: Expired due to Term
First Claim
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1. A control system for a film deposition apparatus having a plurality of processing chambers, comprising:

  • a plurality of control processors, each of the plurality of processors including a memory, being coupled to a subset of the plurality of chambers, and controlling processing in said subset of the plurality of chambers; and

    a data structure provided in said memory including configuration data for each of said plurality of processing chambers;

    wherein said apparatus includes deposition processing hardware to deposit films on a plurality of substrates passing through said plurality of processing chambers, said processing hardware being arranged into subsystems, said subsystems including a pumping system, a heating system, a transport system, and a sputtering gas control system; and

    wherein each of said plurality of processors controls a portion of said subsystems as the plurality of substrates are processed.

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