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Method of making wire-circuit sheet

  • US 5,832,602 A
  • Filed: 12/23/1996
  • Issued: 11/10/1998
  • Est. Priority Date: 01/25/1994
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a wire-circuit sheet comprising the steps of:

  • slidably inserting a plurality of wiring pins into holes formed on a wire-laying base plate, said plurality of pins being resiliently by springs which bias said pins to a position where said pins extend from a surface of said base plate;

    laying wires between said pins by a wire positioning feeder;

    pressing a first resin sheet having adhesive on a surface of said first resin sheet to said wires laid on said base plate to bond said first resin sheet to said wires; and

    pressing a second resin sheet having adhesive on a surface of said second resin sheet to said first resin sheet with said bonded wires, so that said wires are bonded between said first and second resin sheets.

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