Injection molding encapsulation for an electronic device directly onto a substrate

• US 5,833,903 A
• Filed: 12/10/1996
• Issued: 11/10/1998
• Est. Priority Date: 12/10/1996
• Status: Expired due to Term

• Current Assignee: The Great American Gumball Corporation
• Original Assignee: The Great American Gumball Corporation
• Inventors: Centofante, Charles A.
• Primary Examiner(s): ORTIZ, ANGELA Y
• Application Number:
  US08/763,538
• Time in Patent Office: 700 Days
• Field of Search: 264/272.11, 264/272.14, 264/272.15, 264/272.17, 264/273, 264/274, 264/265, 264/155, 264/154, 29/855, 29/856, 445/24
• US Class Current: 264/155
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/2708 Gates B29C45/2703 takes precedence
• CPC Class Codes: B29C 70/74 Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding B29C70/845 takes precedence
• CPC Class Codes: G09F 9/3023 Segmented electronic displays
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.

Claims

1. A method of encapsulating a small electronic device mounted directly on a printed circuit board comprising:

providing a three-dimensional formation on the printed circuit board adjacent to the device; and

injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the printed circuit board; and

wherein the encapsulating material mechanically bonds to the three-dimensional formation on the printed circuit board.

2. The method of claim 1, wherein the three-dimensional formation adjacent to the device includes a hole through the printed circuit board.

3. The method of claim 1, wherein the three-dimensional formation adjacent to the device includes a recess extending below the surface of the printed circuit board.

4. The method of claim 1, wherein the three-dimensional formation adjacent to the device includes a raised member extending above the surface of the printed circuit board.

5. The method of claim 1, wherein the encapsulating material is a thermoplastic resin chosen from among the groups of polycarbonates and acrylics.

6. The method of claim 1, wherein the encapsulating material fully encloses the device.

7. The method of claim 1, wherein the encapsulating material is located on less than the entire surface of the printed circuit board.

8. The method of claim 1, wherein the device comprises a light emitting diode and wherein the encapsulating material is light-transmissive.

23. The method of claim 6, wherein the encapsulating material is located on less than the entire surface of the printed circuit board.

24. The method of claim 23, wherein the device comprises a light emitting diode and wherein the encapsulating material is light-transmissive.

25. The method of claim 24, wherein the three-dimensional formation adjacent to the device includes a hole through the printed circuit board.

9. A method of encapsulating a set of seven light emitting diodes mounted directly to a printed circuit board comprising;

providing a lozenge shaped hole through the printed circuit board adjacent to each of the light emitting diodes, the holes arranged to form a seven-segment display;

injection molding a light-transmissive thermoplastic encapsulating material around each of the light emitting diodes; and

wherein each of the light emitting diodes is separately encapsulated in a package that is shaped to focus and reflect light from the light emitting diode out its adjacent hole and each of the holes is completely filled with the encapsulating material such that the encapsulating material on the side of the printed circuit board opposite from the light emitting diodes is substantially flat and flush with the surface of the printed circuit board.

10. A method of encapsulating a set of light emitting diodes mounted directly to a printed circuit board and arranged to form an alphanumeric display, comprising;

providing a hole through the printed circuit board adjacent to each of the light emitting diodes;

injection molding a light-transmissive thermoplastic encapsulating material around each of the light emitting diodes and extending over each hole; and

wherein each of the light emitting diodes is separately encapsulated in a package that is shaped to focus and reflect light from the light emitting diode and wherein the package is mechanically bonded to the printed circuit board.

11. A method of encapsulating a plurality of small electronic devices mounted directly on a printed circuit board in close proximity to one another comprising:

providing a three-dimensional formation on the printed circuit board adjacent to each device;

injection molding a thermoplastic encapsulating material to individually cover each device and extend over its adjacent three-dimensional formation; and

wherein the encapsulating material mechanically bonds to the three-dimensional formation on the printed circuit board.

12. The method of claim 11, wherein the devices are arranged in a non-uniform arrangement and wherein one or more of the devices are located away from the edges of the printed circuit board.

13. A method of encapsulating a light emitting diode mounted directly on a printed circuit board, comprising:

providing a hole through the printed circuit board adjacent to the light emitting diode; and

injection molding a light-transmissive thermoplastic encapsulating material to encapsulate the light emitting diode and fill the hole, wherein, after encapsulation, the encapsulating material on the side of the printed circuit board opposite from the light emitting diode is substantially flat and flush with the surface of the printed circuit board on the side opposite the light emitting diode.

14. The method of claim 13, wherein the hole is formed by a punch, a laser, or by etching, milling or routing the substrate.

15. The method of claim 13, wherein the hole has a lozenge shape.

16. The method of claim 13, wherein the light emitting diode is mounted directly to the printed circuit board without wires.

17. The method of claim 16, wherein the electrical connections between the light emitting diode and the printed circuit board are pad-to-pad between conductive surfaces on an upper surface of the printed circuit board and on a bottom surface of the light emitting diode.

18. The method of claim 16, wherein the light emitting diode is connected to a trace formed in the printed circuit board.

19. The method of claim 16, wherein the injection molding step causes the encapsulating material to be mechanically bonded to the printed circuit board.

20. The method of claim 18, wherein the injection molding step causes the encapsulating material to be mechanically bonded to the printed circuit board.

21. The method of claim 18, wherein the encapsulating material is shaped to focus and reflect light from the light emitting diode out the adjacent hole.

22. The method of claim 13, wherein the encapsulating material is shaped to focus and reflect light from the light emitting diode out the adjacent hole.