Contoured adhesive wafer for ostomy appliance

• US 5,834,009 A
• Filed: 11/03/1997
• Issued: 11/10/1998
• Est. Priority Date: 04/30/1996
• Status: Expired due to Fees

• Current Assignee: Hollister Incorporated
• Original Assignee: Hollister Incorporated
• Inventors: Gilman, Thomas H., Botten, Ronald S., Ellingson, Eric D., Schneider, Barry L., Engelmann, Werner E., Sawers, Michael F.
• Primary Examiner(s): Page, Thurman K.
• Assistant Examiner(s): Shelborne, Kathryne E.
• Application Number:
  US08/963,316
• Time in Patent Office: 372 Days
• Field of Search: 604/332, 604/336, 604/337, 604/338, 604/339, 604/342, 604/344, 424/443, 424/444, 424/445, 424/446
• US Class Current: 424/443
• CPC Class Codes: A61F 13/0226 characterised by the support layer
• CPC Class Codes: A61F 13/025 having a special distribution arrangement of the adhesive
• CPC Class Codes: A61F 13/0253 characterized by the adhesive material
• CPC Class Codes: A61F 2013/4593 allowing introduction of medical instruments without removing the absorbent article
• CPC Class Codes: A61F 5/443 having adhesive seals for securing to the body, e.g. of hydrocolloid type, e.g. gels, starches, karaya gums adhesives or sealing pads therefor A61L24/00

Abstract

An adhesive wafer for an ostomy pouch, and the combination of such a wafer and pouch, in which the adhesive layer of the wafer is composed of a hydrocolloid-containing skin barrier material and is contoured to provide a relatively thick body portion surrounded by a relatively thin peripheral portion, are disclosed. The wafer has a stoma-receiving opening, and the adhesive layer is of developed shape so that most, if not all, of the relatively thick body portion is located immediately below and to the sides of the stoma-receiving opening. The relatively thin peripheral portion of the adhesive layer is preferably embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by flat-top ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only such ridges.

Claims

1. A wafer for adhesively attaching an ostomy appliance to peristomal skin surfaces of a wearer, said wafer having an adhesive layer consisting of water-absorbing and water-swellable skin barrier material in which particles of one or more hydrocolloids are dispersed in a soft, pliant adhesive medium, and a flexible backing layer for attaching said wafer to a collection pouch;

said adhesive layer being contoured and having a thin peripheral portion and a thick body portion;

said wafer having a stoma-receiving opening surrounded by a circular area of reference having a perimeter concentric with said opening and a radius equal to the distance from the center of said opening to the lowermost limits of said thick body portion;

said circular area of reference including semicircular upper and lower halves wherein said lower half contains a greater quantity of skin barrier material than said upper half.

2. The wafer of claim 1 in which said thick body portion of said adhesive layer surrounds said stoma-receiving opening.

3. The wafer of claim 2 in which said thick body portion of said adhesive layer has a circular periphery;

said stoma-receiving opening having its center spaced above the center of the circle defining the periphery of said body portion.

4. The wafer of claim 1 in which said thick body portion of said adhesive layer is crescent-shaped and is located entirely below and to the sides of said stoma-receiving opening.

5. The wafer of claims 1, 2 or 4 in which said semicircular lower half of said circular area of reference contains at least 10% more skin barrier material than said upper half.

6. The wafer of claim 1, 2 or 4 in which said thin peripheral portion of said adhesive layer has a bodyside surface thereof embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by skin-contacting ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only said ridges of said adhesive layer.

7. The wafer of claim 6 wherein said ridges have flat and co-planar skin-contacting surface portions.

8. The wafer of claim 6 wherein said depressions are arranged in a non-rectilinear pattern of random appearance.

9. The wafer of claim 7 wherein at least some of said depressions are round in outline.

10. The wafer of claim 1 wherein said backing layer is gas-pervious.

11. The wafer of claim 10 wherein said backing layer comprises a porous non-woven fabric.

12. The wafer of claim 6 in which a removable protective release sheet covers the surface of said adhesive layer opposite from said backing layer.

13. The wafer of claim 12 in which said release sheet includes ridges and depressions that conform with the embossed contour of said adhesive layer.