Material transfer apparatus and method of using the same

• US 5,834,062 A
• Filed: 09/03/1997
• Issued: 11/10/1998
• Est. Priority Date: 06/27/1996
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Johnson, Timothy L., Knapp, James H., Laninga, Albert J.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): BARR, MICHAEL E
• Application Number:
  US08/929,232
• Time in Patent Office: 433 Days
• Field of Search: 427/256, 427/96, 427/208.6, 118/208, 118/221, 118/120, 118/401, 118/412, 118/423, 118/500, 118/225, 118/256, 118/243, 118/211, 228/165, 228/33, 228/34, 228/35, 228/43, 228/180.21, 228/180.22, 222/162, 222/163, 222/518, 29/878, 29/842, 29/843, 29/739
• US Class Current: 427/58
• CPC Class Codes: B05C 11/1034 specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material B05C5/0225, B05C11/1026 take precedence
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0338 Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
• CPC Class Codes: H05K 3/3478 Applying solder preforms; Transferring prefabricated solder patterns
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49211 of fused material

Abstract

A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).

Claims

1. A material transfer apparatus comprising:

a support plate movable between a first position and a second position;

a pin having a width and coupled to the support plate so that the support plate directs the pin to the first position and to the second position, wherein the pin has sidewalls;

a cavity plate having an opening so that the pin can pass through the cavity plate and the opening, wherein the pin and the cavity plate provide a cavity in the cavity plate when the pin is in the first position, at least a portion of the pin extends from the cavity plate when the pin is in the second position, and the pin has a clearance in the cavity such that the pin prevents material from passing along the sidewalls of the pin when material is placed in the cavity; and

a well of material that is movable along the bottom surface of the flux transfer apparatus and fills the cavity in the cavity plate with a portion of the material when the pin is in the first position.

2. The material transfer apparatus of claim 1 further comprising a well of a material that fills the cavity with a portion of the material when the pin is in the first position.

3. The material transfer apparatus of claim 2 wherein the material is selected from the group consisting of a solder paste, an adhesive material, a solder, a conductive epoxy, and a flux.

4. The material transfer apparatus of claim 1 wherein the pin is coupled to the support plate by a spring that allows the pin to move a distance equal to or less than the support plate moves.

5. The material transfer apparatus of claim 1 wherein the pin is attached to the support plate so that the pin moves a distance that is substantially equal to a distance that the support plate moves.

6. The material transfer apparatus of claim 1 wherein the pin has a width that is substantially equal to a width of the opening in the cavity plate.

7. The material transfer apparatus of claim 6 wherein the width of the pin is about 0.3 millimeters to 1 millimeter.

8. The material transfer apparatus of claim 7 wherein when the pin is in the first position, the cavity has a depth of about 0.3 millimeters to 1 millimeter.

9. The material transfer apparatus of claim 1 wherein the opening in the cavity plate has sidewalls that are substantially parallel to the pin.

10. The material transfer apparatus of claim 1 wherein the material transfer apparatus is devoid of an air gap along the sidewalls of the pin.

11. A flux transfer apparatus comprising:

a support plate;

a cavity plate having a top surface, a bottom surface, and an opening through the cavity plate from the top surface to the bottom surface;

a pin connected to the support plate, wherein the pin has a tip and the pin is movable to place the tip in a first position that is in the opening of the cavity plate to provide a cavity, and the tip is movable to a second position that extends beyond the bottom surface of the cavity plate;

a means for filling the cavity with solder that is moveable along the bottom surface of the flux transfer apparatus and that fills the cavity in the cavity plate with the solder when the pin is in the first position; and

wherein the pin has a clearance in the cavity that prevents solder from passing along the sidewalls of the pin when the pin is in the first position and solder is placed in the cavity.

12. The flux transfer apparatus of claim 11 wherein a portion of the flux material in the cavity is transferred to an electronic component when the pin is in the second position.

13. The flux transfer apparatus of claim 11 wherein the pin is coupled to the support plate by a spring that allows the pin to move a distance equal to or less than the support plate moves.

14. The flux transfer apparatus of claim 11 wherein the pin is attached to the support plate so that the support plate moves a distance that is substantially equal to a distance that the pin moves.

15. The flux transfer apparatus of claim 11 wherein the pin has a width of about 0.3 millimeters to 1 millimeter, and the width of the pin is substantially equal to a width of the opening in the cavity plate.

16. A method of manufacturing an electronic component by transferring a material comprising the steps of:

providing a support plate that has a pin, the pin having a width and a tip;

providing a cavity plate that has an opening that has a width that is substantially equal to the width of the pin, and the opening allows the pin to pass through the cavity plate;

placing the cavity plate in contact with a well of the material so that the opening in the cavity plate is in contact with a portion of the material; and

moving the pin to a position between a top surface and a bottom surface of the cavity plate to fill the at least a portion of the opening with the material in the well, wherein the width of the pin is sufficient to prevent the material from passing beyond the tip of the pin; and

moving the pin through the opening in the cavity plate so the pin extends a first distance from the cavity plate to transfer the material out of the opening.

17. The method of claim 16 wherein the step of moving the pin through the opening moves the material in the opening onto the pin and a portion of the material on the pin is transferred to an electronic component.

18. The method of claim 17 wherein the material is selected from the group consisting of a solder paste, an adhesive material, a solder, a conductive epoxy, and a flux.

19. The method of claim 16 wherein the pin is connected to the support plate by a spring that allows the pin to move a distance equal to or less than the support plate.

20. The method of claim 16 wherein the pin is attached to the support plate so that the support plate moves a distance that is substantially equal to a distance that the pin moves.

21. A material transfer apparatus for placing a material on a bonding pad comprising:

a support plate movable between a first position and a second position;

a pin having a width and coupled to the support plate so that the support plate directs the pin to the first position and to the second position, wherein the pin has sidewalls;

a cavity plate having an opening so that the pin can pass through the cavity plate and the opening, wherein the cavity plate provides a cavity when the pin is in the first position and the cavity has a width that is substantially constant and equal to the width of the pin;

a means for filling the cavity with material; and

wherein at least a portion of the pin extends from the cavity plate when the pin is in the second position, thereby being capable of directing material onto the bonding pad.