Material transfer apparatus and method of using the same
First Claim
Patent Images
1. A material transfer apparatus comprising:
- a support plate movable between a first position and a second position;
a pin having a width and coupled to the support plate so that the support plate directs the pin to the first position and to the second position, wherein the pin has sidewalls;
a cavity plate having an opening so that the pin can pass through the cavity plate and the opening, wherein the pin and the cavity plate provide a cavity in the cavity plate when the pin is in the first position, at least a portion of the pin extends from the cavity plate when the pin is in the second position, and the pin has a clearance in the cavity such that the pin prevents material from passing along the sidewalls of the pin when material is placed in the cavity; and
a well of material that is movable along the bottom surface of the flux transfer apparatus and fills the cavity in the cavity plate with a portion of the material when the pin is in the first position.
1 Assignment
0 Petitions
Accused Products
Abstract
A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).
-
Citations
21 Claims
-
1. A material transfer apparatus comprising:
-
a support plate movable between a first position and a second position; a pin having a width and coupled to the support plate so that the support plate directs the pin to the first position and to the second position, wherein the pin has sidewalls; a cavity plate having an opening so that the pin can pass through the cavity plate and the opening, wherein the pin and the cavity plate provide a cavity in the cavity plate when the pin is in the first position, at least a portion of the pin extends from the cavity plate when the pin is in the second position, and the pin has a clearance in the cavity such that the pin prevents material from passing along the sidewalls of the pin when material is placed in the cavity; and a well of material that is movable along the bottom surface of the flux transfer apparatus and fills the cavity in the cavity plate with a portion of the material when the pin is in the first position. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A flux transfer apparatus comprising:
-
a support plate; a cavity plate having a top surface, a bottom surface, and an opening through the cavity plate from the top surface to the bottom surface; a pin connected to the support plate, wherein the pin has a tip and the pin is movable to place the tip in a first position that is in the opening of the cavity plate to provide a cavity, and the tip is movable to a second position that extends beyond the bottom surface of the cavity plate; a means for filling the cavity with solder that is moveable along the bottom surface of the flux transfer apparatus and that fills the cavity in the cavity plate with the solder when the pin is in the first position; and wherein the pin has a clearance in the cavity that prevents solder from passing along the sidewalls of the pin when the pin is in the first position and solder is placed in the cavity. - View Dependent Claims (12, 13, 14, 15)
-
-
16. A method of manufacturing an electronic component by transferring a material comprising the steps of:
-
providing a support plate that has a pin, the pin having a width and a tip; providing a cavity plate that has an opening that has a width that is substantially equal to the width of the pin, and the opening allows the pin to pass through the cavity plate; placing the cavity plate in contact with a well of the material so that the opening in the cavity plate is in contact with a portion of the material; and moving the pin to a position between a top surface and a bottom surface of the cavity plate to fill the at least a portion of the opening with the material in the well, wherein the width of the pin is sufficient to prevent the material from passing beyond the tip of the pin; and moving the pin through the opening in the cavity plate so the pin extends a first distance from the cavity plate to transfer the material out of the opening. - View Dependent Claims (17, 18, 19, 20)
-
-
21. A material transfer apparatus for placing a material on a bonding pad comprising:
-
a support plate movable between a first position and a second position; a pin having a width and coupled to the support plate so that the support plate directs the pin to the first position and to the second position, wherein the pin has sidewalls; a cavity plate having an opening so that the pin can pass through the cavity plate and the opening, wherein the cavity plate provides a cavity when the pin is in the first position and the cavity has a width that is substantially constant and equal to the width of the pin; a means for filling the cavity with material; and wherein at least a portion of the pin extends from the cavity plate when the pin is in the second position, thereby being capable of directing material onto the bonding pad.
-
Specification