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Method of assembling a semiconductor device using a magnet

  • US 5,834,320 A
  • Filed: 09/23/1997
  • Issued: 11/10/1998
  • Est. Priority Date: 06/05/1995
  • Status: Expired due to Fees
First Claim
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1. A method of assembling a semiconductor device comprising the steps of:

  • providing a base having a reflowable material on a surface thereof, the reflowable material being glass and has a reflow temperature, and the base being a ceramic base;

    providing a lead frame capable of being magnetized and having a plurality of leads, wherein the lead frame is positioned on the surface of the base;

    placing a magnet on the lead frame;

    subjecting the base, the lead frame, and the magnet to a thermal process involving a temperature of at least the reflow temperature of the reflowable material, wherein during the step of subjecting, the magnet restricts movement of the plurality of leads, thereby maintaining accurate positions of the plurality of leads within the reflowable material; and

    removing the magnet from the lead frame after the step of subjecting.

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