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Method of forming a multi-chip module from a membrane circuit

  • US 5,834,334 A
  • Filed: 06/07/1995
  • Issued: 11/10/1998
  • Est. Priority Date: 04/08/1992
  • Status: Expired due to Term
First Claim
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1. A method of testing an integrated circuit having electrical contracts formed thereon spaced apart a distance of less than about 50 μ

  • m, comprising the steps of;

    providing a flexible tester membrane including a plurality of probe points formed on one surface thereof, and a plurality of integrated circuits attached to an opposing surface thereof for providing test signals to the probe points;

    electrically interconnecting the integrated circuits to the probe points by conductors extending through the tester membrane; and

    providing at least two of the probe points spaced apart less than about 50 μ

    m.

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