Curable polyphenylene ether-thermosetting resin composition and process
First Claim
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1. A curable resin composition comprising:
- (a) at least one polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900 wherein said polyphenylene ether resin comprises a functionalized polyphenylene ether resin and wherein said functionalized polyphenylene ether resin contains at least one species of the group consisting of acid, anhydride, amine, epoxy, oxazoline, orthoester, hydroxyl, phosphate, and phosphonate, and(b) at least one thermosetting resin selected from the group consisting of phenolic, alkyds, polyester, polyurethane, mineral filled silicone, cyanate esters, vinyl, and benzocyclobutene resins.
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Abstract
Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
147 Citations
51 Claims
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1. A curable resin composition comprising:
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(a) at least one polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900 wherein said polyphenylene ether resin comprises a functionalized polyphenylene ether resin and wherein said functionalized polyphenylene ether resin contains at least one species of the group consisting of acid, anhydride, amine, epoxy, oxazoline, orthoester, hydroxyl, phosphate, and phosphonate, and (b) at least one thermosetting resin selected from the group consisting of phenolic, alkyds, polyester, polyurethane, mineral filled silicone, cyanate esters, vinyl, and benzocyclobutene resins. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A thermoset composition made from a curable resin composition consisting essentially of:
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(a) at least one polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900 wherein said polyphenylene ether resin comprises a functionalized polyphenylene ether resin and wherein said functionalized polyphenylene ether resin contains at least one species of the group consisting of acid, anhydride, amine, epoxy, oxazoline, orthoester, hydroxyl, phosphate, and phosphonate, and (b) at least one thermosetting resin selected from the group consisting of phenolic, alkyds, polyester, polyurethane, mineral filled silicone, cyanate esters, vinyl, and benzocyclobutene resins. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A reaction product of a curable resin composition comprising:
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(a) at least one polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900 wherein said polyphenylene ether resin comprises a functionalized polyphenylene ether resin and wherein said functionalized polyphenylene ether resin contains at least one species of the group consisting of acid, anhydride, amine, epoxy, oxazoline, orthoester, hydroxyl, phosphate, and phosphonate, and (b) at least one thermosetting resin selected from the group consisting of phenolic, alkyds, polyester, polyurethane, mineral filled silicone, cyanate esters, vinyl, and benzocyclobutene resins. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48)
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49. A curable composition for impregnating and preparing cured fibrous substrates and which composition when dissolved in an inert solvent is free of gelation at room temperature, said composition comprising in admixture:
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(a) the reaction product of at least one polyphenylene ether resin in an inert organic solvent with a co-reactant that is selected from the group consisting of an oxidizing agent and mixtures of an oxidizing agent with a phenol to afford a polyphenylene ether resin having a number average molecular weight between about 500 to about 2,900; (b) at least one polyepoxide composition comprising; (i) a tetrabromo bisphenol diglycidyl ether, and (ii) an epoxy novolak resin; wherein the polyepoxy composition further comprises a condensation product of a bisphenol diglycidyl ether with a tetrabromo bisphenol, and (c) a catalytic amount of a catalyst. - View Dependent Claims (50, 51)
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Specification