Vacuum microdevice

• US 5,834,790 A
• Filed: 03/27/1997
• Issued: 11/10/1998
• Est. Priority Date: 03/27/1996
• Status: Expired due to Term

• Current Assignee: DENSO Corporation
• Original Assignee: NEC Corporation
• Inventors: Suzuki, Kenichiro
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Wille, Douglas A.
• Application Number:
  US08/824,610
• Time in Patent Office: 593 Days
• Field of Search: 257/10, 313/309, 313/310, 313/311, 438/20
• US Class Current: 257/10
• CPC Class Codes: B81B 1/008 Microtips
• CPC Class Codes: B82Y 15/00 Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
• CPC Class Codes: H01J 3/022 with microengineered cathode, e.g. Spindt-type

Abstract

A vacuum microdevice having a field-emission cold cathode includes a first electrode having a projection portion formed on its surface, the projection having a sharp tip, an insulating film formed in the region of the first electrode, excluding the sharp tip of the projection portion, a second electrode formed in a region on the insulating film, excluding the sharp tip of the projection portion, to planarize the surface of the second electrode, and a structural substrate bonded to the lower surface of the first electrode and having a recess portion in the bonding surface with the lower surface of the first electrode, the recess portion having a size large enough to cover a recess reflecting the sharp tip of the projection portion formed on the lower surface of the first electrode. The interior of the recess portion formed in the structural substrate communicates with the atmosphere outside the device. A support structure is formed on the surface of the second electrode to surround each projection portion formed on the first electrode. With this structure, a vacuum microdevice which can suppress variations in characteristics due to voids, and exhibit excellent long-term reliability can be provided.

Claims

1. A vacuum microdevice comprising:

a first electrode having a projection portion formed on a surface thereof, the projection having a sharp tip;

an insulating film formed in a region of said first electrode, excluding the sharp tip of the projection portion;

a second electrode formed in a region on said insulating film, excluding the sharp tip of the projection portion, to planarize a surface of said second electrode; and

a structural substrate bonded to a lower surface of said first electrode and having a recess portion in a bonding surface with the lower surface of said first electrode, the recess portion having a size large enough to cover a recess reflecting the sharp tip of the projection portion formed on the lower surface of said first electrode.

2. A device according to claim 1, wherein an interior of the recess portion formed in said structural substrate communicates with an atmosphere outside said device.

3. A device according to claim 1, further comprising a support structure formed on a surface of said second electrode to surround the projection portion formed on said first electrode.

4. A device according to claim 3, wherein said support structure consists of a semiconductor and has a (111) side surface.

5. A device according to claim 3, wherein said support structure is made of part of an impurity-diffused layer forming said second electrode.

6. A device according to claim 1, wherein said structure comprises a glass substrate.

7. A device according to claim 1, wherein said first electrode is connected to a metal electrode formed on said structural substrate, said second electrode is connected to another metal electrode formed on said structural substrate through a hole formed in said insulating film, and electrical signals are supplied to said first and second electrodes through said metal electrodes.

8. A device according to claim 1, wherein portions of said first and second electrodes are extended outward to be exposed on a surface side different from a surface to which said structural substrate is bonded, and electrical signals are supplied to said first and second electrodes through the exposed regions.

9. A device according to claim 5, wherein a portion of said second electrode is extended to be exposed on a surface side different from a surface to which said structural substrate is bonded, an electrical signal is supplied to said second electrode through the exposed region, and an electrical signal is supplied to said first electrode through said support structure formed on said first electrode.

10. A vacuum microdevice comprising:

a first electrode having a projection portion formed on a surface thereof, the projection having a sharp tip;

an insulating film formed in a region of said first electrode, excluding the sharp tip of the projection portion;

a second electrode formed in a region on said insulating film, excluding the sharp tip of the projection portion, to planarize a surface of second electrode;

a support substrate formed on a surface of said second electrode; and

a structural substrate having pins and a recess portion, said structural substrate bonded to the support structure,

wherein electrical signals are supplied to the second electrode and the first electrode by the pins of the structural substrate.