Single-polysilicon CMOS active pixel image sensor

• US 5,835,141 A
• Filed: 07/03/1996
• Issued: 11/10/1998
• Est. Priority Date: 11/22/1994
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Inglis, David Andrew, Eid, El-Sayed Ibrarhim, Ackland, Bryan David, Dickinson, Alexander George
• Primary Examiner(s): Faile, Andrew I.
• Assistant Examiner(s): Ho, Tuan V.
• Application Number:
  US08/675,026
• Time in Patent Office: 860 Days
• Field of Search: 348/294, 348/302, 348/303, 348/307, 348/308, 348/311, 348/313, 257/290, 257/234, 257/239, 257/369, 257/72, 377/60
• US Class Current: 348/308
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 31/1136 the device being a metal-insulator-semiconductor field-effect transistor
• CPC Class Codes: H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors

Abstract

A single-polysilicon active pixel, methods for operating and making same, and an imaging device employing same are disclosed. The single-polysilicon active pixel comprises a photo site located on a substrate for generating and storing charge carriers, the charge carriers being generated from photonic energy incident upon the photo site and semiconductor substrate, a photo gate, a transfer transistor and output and reset electronics. The gate of the transfer transistor and the photo gate are defined in a single layer of polysilicon disposed on the semiconductor substrate. The source of transfer transistor is a doped region of substrate, referred to as a coupling diffusion, which provides the electrical coupling between the photo gate and the transfer transistor. The coupling diffusion allows for the transfer of a signal stored in a photo site under the photo gate to the output electronics for processing. A plurality of such single-polysilicon active pixels can be arranged to form an imaging system. The single-polysilicon active pixel may be operated by biasing the transfer transistor to the low operating voltage of the pixel, for example, 0 volts. By virtue of the structure of the single-polysilicon active pixel, this mode of operation results in the same timing as if the transfer transistor were clocked, but neither a clock nor the associated driving circuitry arc required. However, there is little no tendency for image lag as occurs in double polysilicon active pixels when they are operated in a manner which avoids clocking the transfer gate.

Claims

1. A CMOS active pixel for converting an optical signal to an electronic signal, comprising:

a semiconductor substrate wherein charge carriers are generated from incident photonic energy;

a photo gate for collecting the charge carriers, the photo gate having a contact electrically connected to a first region of polysilicon;

a transfer transistor gate for transferring charge between the photo gate and output electronics, the transfer transistor gate having a contact electrically connected to a second region of polysilicon, said second region of polysilicon having a first side and a second side;

a transfer transistor comprising the transfer transistor gate, a first diffusion region and a second diffusion region, wherein the first diffusion region is within the substrate between the first region of polysilicon and the first side of the second region of polysilicon, and wherein the second diffusion region is within the substrate nearest the second side of the second region of polysilicon;

reset electronics electrically connected to the second diffusion region; and

output electronics, electrically connected to the second diffusion region, which receive the charge transferred by the transfer transistor gate and conduct the signal to processing electronics.

2. The CMOS active pixel of claim 1 wherein the photo gate and the transfer transistor gate are formed from a single layer of polysilicon.

3. The single polysilicon CMOS active pixel of claim 2 wherein the output electronics comprise a voltage follower transistor electrically connected to a select transistor, wherein the voltage follower transistor is electrically connected to the second diffusion.

4. The single polysilicon CMOS active pixel of claim 2 wherein the reset electronics comprises a reset transistor.

5. A single-polysilicon active pixel imaging device comprising:

an array of single-polysilicon active pixels arranged in a first group and a second group;

a first common conductor coupled to the active pixels in the first group for conducting control signals;

a second common conductor coupled to the active pixels in the second group for selectively transmitting signals to processing electronics;

wherein,

each of the single-polysilicon active pixels comprises;

a semiconductor substrate wherein charge carriers are generated from incident photonic energy;

a photo gate for collecting the charge carriers, the photo gate having a contact electrically connected to a first region of polysilicon;

a transfer transistor gate for transferring charge between the photo gate and output electronics, the transfer transistor gate having a contact electrically connected to a second region of polysilicon, said second region of polysilicon having a first side and a second side;

a transfer transistor comprising the transfer transistor gate, a first diffusion region and a second diffusion region, wherein the first diffusion region is within the substrate between the first region of polysilicon and the first side of the second region of polysilicon, and wherein the second diffusion region is within the substrate nearest the second side of the second region of polysilicon; and

an amplifying arrangement for selectively receiving signals from the plurality of active pixels and selectively providing output signals to the second common conductor.

6. The single-polysilicon active pixel imaging device of claim 5 wherein the active pixel has a N-channel configuration.

7. The single-polysilicon active pixel imaging device of claim 5 wherein the amplifying arrangement comprises a voltage follower transistor electrically connected to a select transistor, wherein the voltage follower transistor is electrically coupled to the second diffusion region.

8. The single-polysilicon active pixel imaging device of claim 7 further comprising a reset transistor electrically coupled to the second diffusion region and the first common conductor.

9. The single-polysilicon active pixel imaging device of claim 8 further comprising a load transistor coupled to the voltage follower transistor in a source follower configuration.

10. The single-polysilicon active pixel imaging device of claim 5 wherein the amplifying arrangement is CMOS.

11. The single-polysilicon active pixel imaging device of claim 7 wherein the amplifying arrangement is CMOS.

12. The single-polysilicon active pixel imaging device of claim 5 wherein the first group forms a row and the second group forms a column.

13. The single-polysilicon active pixel imaging device of claim 12 further comprising a plurality of rows and columns.

14. The single-polysilicon active pixel imaging device of claim 5 wherein the amplifying arrangement comprises an amplifier and a switch for selectively transmitting the output signal from the amplifier to the second common conductor.

15. A method for operating a single-polysilicon CMOS n-channel active pixel having a photo gate, a clock, and a transfer transistor which has a transfer transistor gate and a diffusion node, the single-polysilicon CMOS active pixel operable by a first voltage and a second voltage, comprising the steps of:

(a) biasing the transfer transistor to the second voltage;

(b) clocking the photo gate to the first voltage, the first voltage on the photo gate being maintained until a first desired period of time has elapsed, wherein a signal is stored in a first region during the first desired period of time;

(c) resetting the diffusion node to a third voltage based on the first voltage;

(d) clocking the photo gate to the second voltage when the first desired period of time has elapsed, and maintaining the second voltage until a second desired period of time has elapsed, wherein, during the second desired period of time, the signal is transferred out of the first region to the diffusion node changing the third voltage on the diffusion node; and

(e) repeating steps (b)-(d).

16. The method of claim 15 wherein the first voltage has a higher potential than the second voltage.

17. The method of claim 15 wherein the first voltage is 5 volts and the second voltage is 0 volts.

18. The method of claim 15 wherein the second voltage is 0 volts.

19. The method of claim 15 wherein the first desired period of time is about 30 milliseconds.

20. The method of claim 15 wherein the step of resetting the diffusion node comprises activating a reset transistor, which reset transistor has a drain biased to the first voltage and has a source electrically connected to the diffusion node.