Printed circuit board-mounted, sealed heat exchanger

• US 5,835,349 A
• Filed: 06/12/1997
• Issued: 11/10/1998
• Est. Priority Date: 06/12/1997
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Straub, Walter H., Giannatto, Carl J., Cornish, Kevin C.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/873,677
• Time in Patent Office: 516 Days
• Field of Search: 165/80.3, 165/122, 165/185, 165/80.4, 165/104.33, 165/139, 165/149, 165/80.5, 257/706, 257/707, 257/712, 257/713, 257/722, 62/259.2, 174/16.1, 174/16.3, 361/692-695, 361/796, 361/831, 361/701-704, 361/707-711, 361/715-719, 361/720-722, 361/699
• US Class Current: 361/701
• CPC Class Codes: H05K 7/1424 Card cages
• CPC Class Codes: H05K 7/202 Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers

Abstract

A housing structure for retaining and cooling a plurality of printed circuit boards includes an arrangement of parallel electrical connectors, which receive associated connectors mounted to respective ones of the printed circuit boards. Integrated with each printed circuit board is a respective frame-configured thermally conductive heat exchanger, that abuts a first side of the printed circuit board. A second side of the printed circuit board contains circuit components to be cooled. Cooling fluid flowing through the adjacent chambers of the heat exchanger draws heat away from the circuit components. A cooling fluid supply and removal plenum is coupled to adjacent fluid inlet and exhaust ports provided at a top end wall of the heat exchanger. Mounting the printed circuit components on the side of the printed circuit board opposite to that to which the heat exchanger is affixed isolates the circuit components from the heat exchanger and thereby prevents the circuit components from being exposed to any potentially corrosive foreign matter that may be present in the cooling fluid flowing through the heat exchanger. In addition, affixing the heat exchanger directly to the printed circuit board increases the flexure stiffness of the circuit board structure.

Claims

1. A housing enclosure for securely retaining and cooling a plurality of printed circuit boards in parallel, spatially aligned relationship comprising:

a chassis having a card-insertion cavity between parallel sidewalls thereof containing a plurality of card-guide slots, that receive and guide side edges of said printed circuit boards for insertion into an arrangement of electrical connectors at a first portion of said chassis, so that said printed circuit boards are retained in mutually adjacent, spatially parallel relationship with one another;

a cooling fluid supply/exhaust plenum at a second portion of said chassis spaced apart from said first portion of said chassis by said card-insertion cavity therebetween, and including

a cooling fluid supply chamber, to which cooling fluid for cooling circuit components of said printed circuit boards is supplied, said cooling fluid supply chamber having a plurality of cooling fluid supply apertures, and

a cooling fluid exhaust chamber adjacent to said cooling fluid supply chamber and from which said cooling fluid having cooled said circuit components of said printed circuit boards is removed, said cooling fluid exhaust chamber having a plurality of cooling fluid removal apertures adjacent to said plurality of cooling fluid supply apertures; and

a plurality of thermally conductive heat exchangers, a respective thermally conductive heat exchanger of said plurality of thermally conductive heat exchangers being attached to and in thermally conductive engagement with a first side of a respective printed circuit board of said plurality of circuit boards, so as to draw heat away from and thereby cool said circuit components mounted to a second side of said respective printed circuit board, and wherein said respective thermally conductive heat exchanger includes

a cooling fluid inlet port joined in sealing engagement with a respective cooling fluid supply aperture of said plurality of cooling supply apertures of said cooling fluid supply chamber of said cooling fluid supply/exhaust plenum, and through which said cooling fluid is introduced from said cooling fluid supply/exhaust plenum, and

a cooling fluid outlet port adjacent to said cooling fluid inlet port and joined in sealing engagement with a respective cooling fluid removal aperture of said plurality of cooling fluid removal apertures of said cooling fluid exhaust chamber of said cooling fluid supply/exhaust plenum, and through which said cooling fluid is exhausted from said heat exchanger into said cooling fluid supply/exhaust plenum.

2. A housing enclosure according to claim 1, wherein said respective thermally conductive heat exchanger further includes:

a frame having a first end wall adjoining said fluid supply/exhaust plenum and containing said cooling fluid inlet port and said cooling fluid outlet port, side walls parallel with side edges of said printed circuit cards, a second end wall opposite to said first end wall, and a back wall, that enclose first and second adjacent cooling fluid flow chambers, and a further wall that extends from said first end wall to a location spaced apart from said second end wall, so as to provide an intra chamber fluid communication port connecting said first and second cooling fluid flow chambers, and a heat exchanger cover plate, and wherein said heat exchanger further includes first and second thermally conductive heat exchange elements, respectively retained in and substantially filling said first and second cooling fluid flow chambers, but leaving a fluid circulation region therein that provides a fluid flow loop path for cooling fluid that has entered said first chamber via said cooling fluid inlet port in said first end wall of said frame, and has traveled through said first heat exchange element and, upon exiting said first heat exchange element, travels through said fluid circulation region and said second heat exchange element in said second chamber, exiting through said cooling fluid exhaust port in said first end wall of said frame.

3. A housing enclosure according to claim 1, further including gasket material that seals interfaces between said cooling fluid supply and removal apertures of said supply/exhaust plenum and said fluid inlet and exhaust ports, respectively, of said plurality of thermally conductive heat exchangers.

4. A housing enclosure according to claim 3, wherein said gasket material comprises a multi-apertured gasket inserted between said supply/exhaust plenum and said first end wall of said heat exchanger.

5. A housing enclosure for securely retaining and cooling a plurality of printed circuit boards in parallel, spatially aligned relationship comprising a chassis having parallel sidewalls adjoining parallel end walls that define a card-insertion cavity therebetween, said card insertion cavity having a plurality of card-guide slots that receive and guide side edges of said printed circuit boards for insertion into an arrangement of parallel, multi-pin electrical connectors of a first portion of said chassis, so that said printed circuit boards may be inserted into and retained in mutually adjacent, spatially parallel relationship with one another, and wherein a first side of a respective printed circuit board of said plurality of circuit boards is attached to a thermally conductive heat exchanger, which is configured to draw heat away from and thereby cool circuit components mounted to a second side of said respective printed circuit board, and wherein said thermally conductive heat exchanger has a first enclosed cooling fluid flow chamber containing thermally conductive heat exchange elements through which a cooling fluid supplied to a fluid inlet port of said heat exchanger passes, and a second enclosed cooling fluid flow chamber in fluid communication with said first enclosed cooling fluid flow chamber, and containing thermally conductive heat exchange elements through which said cooling fluid exiting said first enclosed cooling fluid flow chamber passes, said second enclosed cooling fluid flow chamber having a cooling fluid exhaust port adjacent to said cooling fluid inlet port, and wherein said thermally conductive heat exchanger includes a frame having has a first end wall, side walls parallel with side edges of said printed circuit cards, a second end wall opposite to said first end wall, and a back wall, that enclose first and second adjacent cooling fluid flow chambers, which are respectively coupled to cooling fluid inlet and exhaust ports formed within said first end wall, and wherein said frame has a further wall that extends from said first end wall to a location spaced apart from said second end wall, so as to provide an intra chamber fluid communication port connecting said first and second cooling fluid flow chambers, and a heat exchange cover plate, and wherein said heat exchanger further includes first and second thermally conductive heat exchange elements, respectively retained in said first and second cooling fluid flow chambers, and substantially filling said chambers, but leaving a fluid circulation region therein that provides a fluid flow loop path for cooling fluid that has entered said first chamber via said cooling fluid inlet port in said first end wall of said frame, and has traveled through said first heat exchange element and, upon exiting said first heat exchange element, travels through said fluid circulation region and said second heat exchange element in said second chamber, exiting through said cooling fluid exhaust port in said first end wall of said frame, and further including a cooling fluid supply/exhaust plenum mounted to said chassis, said cooling fluid supply/exhaust plenum including a cooling fluid supply chamber and a cooling fluid removal chamber that are in fluid communication with the first and second adjacent cooling fluid flow chambers of the thermally conductive heat exchanger of each of said printed circuit boards, and wherein said cooling fluid supply chamber of said cooling fluid supply/exhaust plenum has a set of cooling fluid supply apertures that are joined in sealing engagement with fluid inlet ports of heat exchangers of said printed circuit boards, and a set of cooling fluid removal apertures that are joined in sealing engagement with fluid exhaust ports of said heat exchangers of said printed circuit boards retained in associated card-guide slots of said plurality of card-guide slots of said chassis.

6. A housing enclosure according to claim 5, further including gasket material sealing interfaces between said apertures of said supply/exhaust plenum and fluid inlet and exhaust ports of heat exchangers of said printed circuit boards.

7. A housing enclosure according to claim 6, wherein said gasket material comprises a multi-apertured gasket inserted between said supply/exhaust plenum and said first end wall of said heat exchanger.