Encapsulated, board-mountable power supply and method of manufacture therefor
First Claim
1. A power supply, comprising:
- a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device;
a thermally-conductive case having an integral electrically insulating layer, said thermally-conductive case forming a reservoir to receive said circuit board therein;
a power semiconductor device having a body connected in thermal communication with said thermally-conductive case and terminals coupled to said conductors of said circuit board;
an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and
electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board.
6 Assignments
0 Petitions
Accused Products
Abstract
A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allow the power supply to be coupled to a printed wiring board.
102 Citations
18 Claims
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1. A power supply, comprising:
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a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; a thermally-conductive case having an integral electrically insulating layer, said thermally-conductive case forming a reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said thermally-conductive case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A power supply, comprising:
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a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming windings and a core disposed through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; a metal case having an integral electrically insulating middle layer and an integral electrically conductive inner circuit layer, portions of said inner circuit layer capable of being removed to form electrically conductive aces therein, said metal case forming a five-sided reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said metal case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of manufacturing a power supply, comprising the steps of:
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providing a circuit board containing conductors interconnecting electrical components of sad power supply, one of said conductors forming windings; mounting ones of said electrical components to said circuit board; placing a body of a power semiconductor device in thermal communication with a thermally-conductive case, said thermally-conductive case having an integral electrically insulating layer; disposing a core through apertures of said circuit board proximate said windings, said windings and said core forming a power magnetic device; placing said circuit board within a reservoir of said thermally-conductive case; coupling terminals of said power semiconductor device to said conductors of said circuit board; and placing an encapsulant within said reservoir, said encapsulant ensconcing said power semiconductor device, said power magnetic vice and said electrical components, electrical leads extending from said power supply to allow said power supply to be coupled to a printed wiring board. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification