Power amplifying module

• US 5,835,352 A
• Filed: 06/21/1996
• Issued: 11/10/1998
• Est. Priority Date: 06/22/1995
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Otobe, Kenji, Matsuzaki, Ken-ichiro, Hashinaga, Tatsuya, Ishii, Gaku
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/669,002
• Time in Patent Office: 872 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 174/16.3, 257/706-707, 257/712-713, 257/718-719, 361/704, 361/707, 361/716-722, 361/761, 361/763-764, 361/774, 361/776, 361/812
• US Class Current: 361/707
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0919 Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes shielding provided by an inner layer of PCB H05K2201/0723
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00

Abstract

A power amplifying module has a package formed by welding a package bottom plate being a package substrate of a generally flat plate shape with a cap being a metal package cap of a generally rectangular box shape. A wiring substrate of a generally flat plate shape is placed on the package bottom plate and this wiring substrate is covered by the cap. There are two through holes formed in the wiring substrate and two heat spreaders of a generally flat plate shape are positioned in portions exposed through the through holes on the package bottom plate. Semiconductor devices sealed with a resin or the like are set by soldering or the like on respective surfaces of these heat spreaders.

Claims

1. A power amplifying module comprising:

a wiring substrate having a through hole is formed therein so as to penetrate between a principal surface and a back surface thereof,

an electronic circuit pattern formed on the principal surface of the substrate;

a metal package substrate on which said wiring substrate is mounted, said metal package substrate having a two substantially flat surfaces opposite to each other through said metal package substrate;

a heat spreader mounted on one of said flat surfaces of said metal package substrate and exposed through the through hole provided in said wiring substrate, said heat spreader being made of a material having a thermal conductivity that is larger than that of the material of said wiring substrate;

a semiconductor device in molded form fixed on a top surface of said heat spreader and having a terminal extending from a side surface of said semiconductor device in a direction parallel with a bottom surface of said semiconductor device and connected to a part of said electronic circuit pattern;

a plurality of leads pins fixed to an end of said wiring substrate, each extending from the end of the wiring substrate downward, and the lowest portions of said lead pins being substantially on the same plane as the other flat surface of said metal package each of said metal package substrate; and

a package cap for housing said wiring substrate inside and fixed to said metal package substrate, wherein said metal package substrate is bonded on said wiring substrate without contacting said plurality of lead pins.

2. A power amplifying module according to claim 1, wherein the heat spreader has a thickness that is substantially equal to that of said wiring substrate.

3. A power amplifying module according to claim 1, wherein said heat spreader is made of Cu.

4. A power amplifying module according to claim 1, wherein said heat spreader is made of CuW.

5. A power amplifying module according to claim 1, wherein said metal package substrate is made of Cu.

6. A power amplifying module according to claim 1, wherein said metal package substrate is made of FeNi alloy.