Tape ball grid array package with perforated metal stiffener

• US 5,835,355 A
• Filed: 09/22/1997
• Issued: 11/10/1998
• Est. Priority Date: 09/22/1997
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Dordi, Yezdi N.
• Primary Examiner(s): Sparks, Donald
• Application Number:
  US08/934,529
• Time in Patent Office: 414 Days
• Field of Search: 29/830-832, 29/840, 29/483, 174/16.3, 174/260, 174/261, 174/252, 174/254, 174/268, 228/180.21, 228/180.22, 257/700, 257/697, 257/698, 257/704, 257/707, 257/708, 257/710, 257/712, 257/713, 257/718, 257/719, 257/723, 257/724, 257/728, 257/738, 257/773, 257/772, 257/778, 257/779, 257/780, 361/688, 361/690, 361/692, 361/707, 361/709, 361/710, 361/712, 361/713, 361/717-720, 361/749, 361/752, 361/753, 361/760, 361/761-764, 361/777, 361/779, 361/783, 361/818, 361/807, 361/809, 361/748, 165/80.2, 165/80.3, 165/185, 438/108, 438/121, 438/122, 438/125-127, 438/612, 438/613
• US Class Current: 361/760
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A tape ball grid array (TBGA) package, and a method of making a TBGA package, includes the use of a metal or other stiffener affixed to a flexible tape on which conductive traces connect contact points on an integrated circuit (IC) chip with an array of solder balls. The stiffener is perforated with a pattern of small vent holes. The TBGA package materials are hygroscopic. When the TBGA package is heated during 2nd level packaging, e.g., during solder reflow, moisture absorbed within the hygroscopic materials evaporates and the resulting water vapor is able to escape through the vent holes, rather than becoming trapped within the IC package and introducing various 2nd level packing failure modes.

Claims

1. An electronic package, comprising:

an integrated circuit chip having a first surface whereon contact pads are located, said contact pads representing electrical interconnection points of the chip;

a non-conductive tape having a plurality of conductive traces electrically coupled to the contact pads of the chip;

a plurality of solder balls coupled to the plurality of conductive traces; and

a stiffener affixed to the tape that has a plurality of vent holes therein.

2. The electronic package of claim 1 wherein the vent holes are distributed over the surface of the stiffener in a prescribed array.

3. The electronic package of claim 2 wherein the prescribed array strategically positions at least one vent hole for each n solder balls, where n is an integer.

4. The electronic package of claim 3 wherein n is one.

5. The electronic package of claim 3 wherein n is four.

6. The electronic package of claim 1 wherein there is at least one vent hole for each 16 solder balls.

7. The electronic package of claim 1 wherein the vent holes have a diameter of at least 0.254 mm (0.010 inches).

8. The electronic package of claim 7 wherein the vent holes have a diameter no greater than about 2.54 mm (0.100 inches).

9. The electronic package of claim 7 wherein the vent holes are arranged in a linear array made up of rows and columns, and wherein the rows are separated by a distance that is at least about 0.51 mm, and the columns are separated by a distance that is at least about 0.51 mm.

10. A tape ball grid array (TBGA) integrated circuit (IC) package for housing a semiconductor integrated circuit (IC) chip, said IC chip having contact pads thereon, comprising:

means for electrically connecting the contact pads of the IC chip to conductive traces on a first surface of a tape;

means for electrically coupling solder balls on a second surface of the tape to each conductive trace connected to a contact pad of the IC chip; and

stiffener means for adding rigidity to said tape, said stiffener means having vent means therein for venting water vapor or other gases absorbed within the tape or other materials of the TBGA IC package during a second level packaging operation.

11. The TBGA IC package set forth in claim 10 wherein said stiffener means comprises a perforated rigid stiffener affixed to a surface of the tape, said perforated rigid stiffener having a plurality of vent holes therethrough.

12. The TBGA IC package set forth in claim 10 wherein said stiffener means comprises a sheet of rigid material affixed to a surface of the tape, and wherein said vent means comprises at least one vent hole therethrough.

13. The TBGA package set forth in claim 11 wherein the sheet of rigid material comprises a metal.

14. The TBGA package set forth in claim 11 wherein the size of the vent holes within the stiffener ranges between about 0.254 mm to 2.54 mm in diameter.

15. The TBGA package set forth in claim 14 wherein the ratio of vent holes to solder balls varies between 1:

16 and 1;

1.

16. The TBGA package set forth in claim 11 further including a porous adhesive that bonds said stiffener means to a surface of the tape, the porous adhesive comprising a material that allows water vapor or other gases to pass therethrough.

17. The TBGA package set forth in claim 11 further including an adhesive that bonds said stiffener to a surface of the tape without blocking all of the vent holes that pass through the stiffener.

18. A method of making a tape ball grid array (TBGA) integrated circuit package wherein an integrated circuit (IC) chip, having contact pads on one surface thereof, is housed, said method comprising:

forming conductive traces on a surface of a non-conductive tape;

electrically connecting the contact pads of the IC chip to the conductive traces on the tape;

electrically coupling a solder ball to each conductive trace connected to a contact pad of the IC chip; and

attaching a perforated stiffener material to the non-conductive tape, said perforated stiffener having a plurality of vent holes therein, thereby providing an escape channel through which a gas, such as water vapor, may vent during a second level packaging operation.

19. The method of making a TBGA IC package as in claim 18 further comprising forming at least one vent hole in said perforated stiffener for each n solder balls of the IC chip, where n is an integer of at least 1.

20. The method of making a TBGA IC package as in claim 18 wherein the step of attaching the perforated stiffener to the non-conductive tape comprises bonding the perforated stiffener to the non-conductive tape using an adhesive that does not prevent gases from venting through at least some of the vent holes in the stiffener.