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Method and apparatus to locate and measure capillary indentation marks on wire bonded leads

  • US 5,835,622 A
  • Filed: 08/31/1995
  • Issued: 11/10/1998
  • Est. Priority Date: 05/02/1994
  • Status: Expired due to Term
First Claim
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1. In a system capable of acquiring, digitizing and analyzing an image a method for locating and measuring a capillary indentation mark on a wire bonded lead, comprising the steps of:

  • selecting a candidate center location in said image;

    creating a one-dimensional circumferential projection for said candidate center location such that a bin of said one-dimensional circumferential projection contains a normalized pixel intensity value for the circumference of an expected shape at said candidate center location;

    detecting signals in said one-dimensional circumferential projection that correspond to a predefined pattern for a capillary indentation mark; and

    storing the results of said detecting step, so that as each candidate center location is evaluated, the candidate center location with the one-dimensional circumferential projection having the best fit is deemed the center of said capillary indentation mark, and the distance from said candidate center location with the one-dimensional circumferential projection having the best fit to its edge is deemed to be the radius of said capillary indentation mark, thus locating and measuring said capillary indentation mark.

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