Method of removing a component from a substrate
First Claim
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1. A method of disassembling an electrical component from a substrate wherein the substrate includes a first bore and the component is releasably bonded to a first face of the substrate over the first bore, the method comprising the steps of:
- providing a fixture for accepting the substrate wherein the fixture has a second bore and a pin in the bore;
securing a second face of the substrate opposing its first face to the fixture such that the first bore is aligned with the second bore;
pushing the pin through the aligned bores into contact with the component; and
advancing the pin against the component to force the component away from the substrate.
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Abstract
A method of removing a component bonded to a substrate utilizes a fixture having a bore therethrough which is aligned with a bore in the substrate. A screw is advanced in the bore in the fixture to cause a push pin to contact the component and force the component away from the substrate.
44 Citations
15 Claims
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1. A method of disassembling an electrical component from a substrate wherein the substrate includes a first bore and the component is releasably bonded to a first face of the substrate over the first bore, the method comprising the steps of:
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providing a fixture for accepting the substrate wherein the fixture has a second bore and a pin in the bore; securing a second face of the substrate opposing its first face to the fixture such that the first bore is aligned with the second bore; pushing the pin through the aligned bores into contact with the component; and advancing the pin against the component to force the component away from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of disassembling an electrical component from a substrate wherein the substrate includes a first plurality of bores and the electrical component is releasably bonded to the substrate over the first plurality of bores, the method comprising the steps of:
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providing a fixture for accepting the substrate wherein the fixture has a second plurality of bores; securing the substrate to the fixture such that at least one of the first plurality of bores is aligned with one of the second plurality of bores to form at least one pair of aligned bores; inserting a pin into each pair of aligned bores; inserting a pusher member into each pair of aligned bores to force the pin therein into contact with the electrical component; and advancing each pusher member to force the electrical component away from the substrate. - View Dependent Claims (10, 11, 12, 13)
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14. A method of disassembling an electrical component from a substrate wherein the substrate includes a first plurality of bores and the electrical component is releasably bonded by an adhesive to the substrate over the first plurality of bores, the method comprising the steps of:
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providing a fixture for accepting the substrate wherein the fixture has a second plurality of bores each which is threaded; securing the substrate to the fixture such that each of the first plurality of bores is aligned with one of the second plurality of bores to form pairs of aligned bores; inserting a pin into each pair of aligned bores; inserting a ball bearing into each pair of aligned bores; screwing a screw into each of the second plurality of bores to force the ball bearing against the pin therein and to force the pin into contact with the electrical component; and continuing to screw each screw to cause the pin to force the electrical component away from the substrate. - View Dependent Claims (15)
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Specification