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Process for bonding a shell to a substrate for packaging a semiconductor

  • US 5,837,562 A
  • Filed: 07/07/1995
  • Issued: 11/17/1998
  • Est. Priority Date: 07/07/1995
  • Status: Expired due to Term
First Claim
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1. A method for forming a vacuum enclosure enclosing a semiconductor device, said method comprising:

  • providing a substrate;

    disposing a semiconductor device on said substrate;

    forming a plurality of electrical leads in communication with said semiconductor device on said substrate, wherein said step of forming further comprisesdepositing a lower layer of refractory metal on said substrate, anddepositing an upper layer of soft metal over said lower layer;

    positioning a shell having a concave surface with surrounding edges on said substrate, on said plurality of electrical leads, and over said semiconductor device; and

    anodically bonding said shell to said substrate, including eutectically sealing said shell edges to said upper layer of each of said plurality of electrical leads.

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