Process for bonding a shell to a substrate for packaging a semiconductor
First Claim
1. A method for forming a vacuum enclosure enclosing a semiconductor device, said method comprising:
- providing a substrate;
disposing a semiconductor device on said substrate;
forming a plurality of electrical leads in communication with said semiconductor device on said substrate, wherein said step of forming further comprisesdepositing a lower layer of refractory metal on said substrate, anddepositing an upper layer of soft metal over said lower layer;
positioning a shell having a concave surface with surrounding edges on said substrate, on said plurality of electrical leads, and over said semiconductor device; and
anodically bonding said shell to said substrate, including eutectically sealing said shell edges to said upper layer of each of said plurality of electrical leads.
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Accused Products
Abstract
A process for manufacturing a vacuum enclosure for a semiconductor device formed on a substrate with leads extending peripherally. Assembly of the enclosure is compatible with known batch fabrication techniques and is carried out at pressures required for optimal device operation. In a first embodiment, an intrinsic silicon shell is sealed to the substrate via electrostatic or anodic bonding with the leads diffusing into the shell. In a second embodiment, a thin interface layer of silicon or polysilicon is deposited on the substrate prior to electrostatic bonding a glass shell thereon. In a third embodiment, tunnels are formed between a lower peripheral edge of the shell and the substrate, allowing leads to pass thereunder. The tunnels are sealed by a dielectric material applied over the enclosure.
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Citations
11 Claims
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1. A method for forming a vacuum enclosure enclosing a semiconductor device, said method comprising:
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providing a substrate; disposing a semiconductor device on said substrate; forming a plurality of electrical leads in communication with said semiconductor device on said substrate, wherein said step of forming further comprises depositing a lower layer of refractory metal on said substrate, and depositing an upper layer of soft metal over said lower layer; positioning a shell having a concave surface with surrounding edges on said substrate, on said plurality of electrical leads, and over said semiconductor device; and anodically bonding said shell to said substrate, including eutectically sealing said shell edges to said upper layer of each of said plurality of electrical leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming a vacuum enclosure enclosing a semiconductor device, said method comprising:
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providing a substrate; disposing a semiconductor device on said substrate; forming a plurality of electrical leads in communication with said semiconductor device on said substrate; positioning a shell having a concave surface with surrounding edges on said substrate, on said plurality of electrical leads, and over said semiconductor device; inserting spacers between said shell and said substrate; backfilling said enclosure with inert gas to evacuate moisture from within said enclosure; subjecting said enclosure to anodic bonding conditions to electrostatically outgas materials from said enclosure which could adversely effect subsequent bonding; removing said spacers; and bonding said shell to said substrate.
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Specification