Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom
First Claim
1. A woven glass cloth comprising warps and wefts and having a mass of 15 to 30 g/m2, suitable for use as a base material to be resin-impregnated for printed wiring board material, wherein one of the warps and the wefts comprise strands having a denier of 75 or more, said strands having a denier of 75 or more being thicker than strands of the other of the warps and the wefts, and a thread count of the thicker strands per unit length is set smaller than that of the other strands.
3 Assignments
0 Petitions
Accused Products
Abstract
To enhance the tear strength without increasing the thickness, a woven glass cloth having a mass of 15 to 30 g/m2, for use as a base material for printed wiring board material, is characterized in that the weft or warp is provided by a 75 denier or more strand, thicker than the warp, and thread count of the thicker strand per unit length is set smaller than that of the other strand.
49 Citations
13 Claims
- 1. A woven glass cloth comprising warps and wefts and having a mass of 15 to 30 g/m2, suitable for use as a base material to be resin-impregnated for printed wiring board material, wherein one of the warps and the wefts comprise strands having a denier of 75 or more, said strands having a denier of 75 or more being thicker than strands of the other of the warps and the wefts, and a thread count of the thicker strands per unit length is set smaller than that of the other strands.
- 6. A prepreg comprising a woven glass cloth impregnated with resin, suitable for use as a base material for printed wiring board material, wherein the woven glass cloth comprises warps and wefts and has a mass of 15 to 30 g/m2, one of the warps and the wefts comprise strands having a denier of 75 or more, said strands having a denier of 75 or more being thicker than strands of the other of the warps and the wefts, and a thread count of the thicker strands per unit length is set smaller than that of the other strands, and the resin comprises a thermosetting resin.
- 10. A laminate suitable for use as a printed wiring board material, which comprises at least one prepreg laminated with at least a metal foil for wiring and to be subjected to a hot, pressure molding process, wherein the at least one prepreg comprises a thermosetting resin-impregnated woven glass cloth comprising warps and wefts and having a mass of 15 to 30 g/m2, one of the warps and the wefts comprise strands having a denier of 75 or more, said strands having a denier of 75 or more being thicker than strands of the other of the warps and the wefts, and a thread count of the thicker strands per unit length is set smaller than that of the other strands, and the laminated at least one prepreg not including the metal foil, after molding has a thickness of 0.040 to 0.080 mm as an insulating layer of the resulting laminate.
-
13. A multilayer printed wiring board comprising an inner printed wiring board, at least one prepreg for an insulating layer and at least one metal foil for wiring which are laminated and subjected to a hot, pressure molding process, wherein the at least one prepreg comprises a woven glass cloth impregnated with resin, the woven glass cloth comprising warps and wefts and having a mass of 15 to 30 g/m2, one of the warps and the wefts comprise strands having a denier of 75 or more, said strands having a denier of 75 or more being thicker than strands of the other of the warps and the wefts, and a thread count of the thicker strands per unit length is set smaller than that of the other strands.
Specification