Integral rigid chip test probe

• US 5,838,160 A
• Filed: 11/08/1996
• Issued: 11/17/1998
• Est. Priority Date: 04/07/1994
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Lauro, Paul Alfred, Shih, Da-Yuan, Walker, George Frederick, Fogel, Keith Edward, Beaman, Brian Samuel, Norcott, Maurice Heathcote
• Primary Examiner(s): Ballato, Josie
• Assistant Examiner(s): KOBERT, RUSSELL MARC
• Application Number:
  US08/744,903
• Time in Patent Office: 739 Days
• Field of Search: 439/78, 439/83, 439/66, 439/91, 437/180, 437/183, 324/761, 324/754
• US Class Current: 324/755.03
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys

Abstract

The present invention is directed to probe structures for testing of electrical interconnections to integrated circuit devices and other electronic components and particularly to testing integrated circuit devices with high density area array solder ball interconnections. The probe structure is formed from a substrate having a surface having at least one electrical contact location which has a perimeter which is raised above the surface and a location within the boundaries of said perimeter which is raised above the surface.

Claims

1. A structure comprising:

a substrate having a surface;

said surface has a plurality of electrically conductive bumps disposed on said surface;

each of said electrically conductive bumps has an electrically conductive perimeter which is raised above said surface and an electrically conductive portion within the boundaries of said perimeter which is raised above said surface, there being a region of said electrically conductive bump between said electrically conductive perimeter and said electrically conductive portion, said electrically conductive perimeter and said electrically conductive portion are raised above said region; and

said electrically conductive bump remains substantially stationary with respect to said surface when said structure is disposed to press said bumps in contact with a workpiece.

2. A structure according to claim 1, wherein said electrically conductive contact location is formed from a unitary body of electrically conductive material.

3. A structure according to claim 1, further including another substrate wherein said another substrate has at least one electrical contact location on a surface thereof which has an electrically conducting protuberance disposed thereon which is disposed in electrical contact with said location within the boundaries of said perimeter.

4. The structure according to claim 1, wherein said structure is an electrical probe.

5. The structure according to claim 4, further including a housing and means for moving said electrical probe in electrical engagement with a workpiece to be electrically probed forming an electrical testing apparatus.