System and method for incremental fabrication of circuit boards

• US 5,838,567 A
• Filed: 07/10/1996
• Issued: 11/17/1998
• Est. Priority Date: 04/29/1994
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Company (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Boggio, Robert F. Jr.
• Primary Examiner(s): GRANT, WILLIAM ALEXANDER
• Assistant Examiner(s): Brown, Thomas E.
• Application Number:
  US08/677,989
• Time in Patent Office: 860 Days
• Field of Search: 364/468, 364/468.01, 364/468.02, 364/468.03, 364/468.04, 364/468.24, 364/468.25, 364/468.28, 364/488-491, 29/840, 29/564, 29/564.1, 29/573, 29/739-743, 29/703
• US Class Current: 700/121
• CPC Class Codes: H05K 2201/09836 Oblique hole, via or bump
• CPC Class Codes: H05K 2203/0235 Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
• CPC Class Codes: H05K 3/00 Apparatus or processes for manufacturing printed circuits
• CPC Class Codes: H05K 3/1241 by ink-jet printing or drawing by dispensing
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

Circuit boards are fabricated in an incremental fashion. Conventional design data representing a layout of the circuit board is received. The design data is transformed into a three-dimensional matrix of increments (e.g., cubes) representing the circuit board, where each increment or cube within the matrix is identified by an address and is assigned a fabrication material. The circuit board is then built at a fabrication station by depositing the assigned fabrication materials onto a fabrication base in an incremental fashion as indicated by the matrix.

Claims

1. A computer-based method for depositing material onto a fabrication base to form a circuit board, the method carried out prior to insertion of pre-fabricated components into the circuit board, the method comprising the steps of:

(a) receiving design data representing a layout of the circuit board;

(b) transforming said design data into a three-dimensional matrix of increments, each increment being identified within said matrix by an address and being assigned a raw fabrication material selected from a plurality of such raw fabrication materials; and

(c) depositing said assigned raw fabrication materials onto the fabrication base in an incremental three-dimensional fashion as indicated by said matrix to thereby three-dimensionally form the circuit board so that it is suitable for subsequent insertion of pre-fabricated components.

2. The computer-based method of claim 1, wherein step (b) comprises the steps of:

(1) calculating an increment size based on design features of the circuit board;

(2) generating a generic matrix of increments approximately representing physical dimensions of the circuit board;

(3) removing increments from selected locations of said generic matrix to form cut-out features of the circuit board;

(4) adding increments to selected locations of said generic matrix to form protruding features of the circuit board; and

(5) assigning a fabrication material to each increment in said generic matrix.

3. The computer-based method of claim 2, wherein step (b)(5) comprises the steps of:

(i) assigning a conductor fabrication material to each increment in said generic matrix that is designated as a conductor by said design data;

(ii) assigning a null material to each increment in said generic matrix that is designated as an open space by said design data; and

(iii) assigning a dielectric material to each increment in said generic matrix not assigned a fabrication material in one of steps (b)(4)(i) and (b)(4)(ii).

4. The computer-based method of claim 1, wherein step (c) comprises the steps of:

(1) positioning an applicator assembly to a starting position above said fabrication base, said starting position corresponding to an address of a first increment in a first layer of said matrix representing the circuit board;

(2) depositing a fabrication material assigned to said first increment on said fabrication base at a position corresponding to said address of said first increment;

(3) positioning said applicator assembly to a next position corresponding to an address of an adjacent increment;

(4) depositing a fabrication material assigned to said adjacent increment on said fabrication base at a position corresponding to said address of said adjacent increment;

(5) repeating steps (c)(3)-(c)(4) for each increment in said first layer of said matrix representing the circuit board;

(6) positioning said applicator assembly to a next layer of said matrix above said first layer;

(7) repeating steps (c)(1)-(c)(5) for said next layer of said matrix; and

(8) repeating steps (c)(6)-(c)(7) for each remaining layer of the circuit board.

5. The computer-based method of claim 1, further comprising:

(d) inserting pre-fabricated components into the circuit board.

6. The computer-based method of claim 1, wherein step (c) comprises:

(1) depositing said assigned raw fabrication materials to integrally form discrete components in the circuit board.

7. The computer-based method of claim 1, wherein said assigned raw fabrication materials comprise conductive raw materials, dielectric raw materials, and null raw materials.

8. A computer-based system for depositing material onto a fabrication site to form a circuit board suitable for subsequent insertion of pre-fabricated components comprising:

transformation means for receiving data specifying design requirements of the circuit board and for generating, from said data, a three-dimensional matrix of increments, each increment being identified within said matrix by an address and being assigned a raw fabrication material selected from a plurality of such raw fabrication materials;

base means for providing the fabrication site for the circuit board; and

fabrication means for depositing said assigned raw fabrication materials on said base means in an incremental three-dimensional fashion as indicated by said matrix to thereby three-dimensionally form the circuit board so that it is suitable for subsequent insertion of pre-fabricated components.

9. The computer-based system of claim 8, wherein said fabrication means comprises:

raw material supply means for receiving fabrication materials to be used in the fabrication of the circuit board;

applicator means for receiving said fabrication materials from said raw material supply means and for depositing incremental quantities of said fabrication materials on said base means;

positioning means for positioning said applicator means relative to said base means; and

control means for controlling said applicator means and said positioning means to build the circuit board in accordance with said matrix.

10. The computer-based system of claim 9, wherein said transformation means comprises a general purpose computer.

11. An apparatus for depositing material onto a fabrication base to form a circuit board suitable for subsequent insertion of pre-fabricated components, comprising:

a fabrication cabinet having

an applicator assembly configured to receive a plurality of raw fabrication materials and to deposit a three-dimensional array of incremental amounts of said plurality of raw fabrication materials onto said fabrication base, and

a positioning system configured to position said applicator assembly relative to said fabrication base; and

a fabrication controller configured to control said applicator assembly and said positioning system, wherein said fabrication controller uses a three-dimensional matrix of increments, each increment being identified within said matrix by an address and being assigned a raw fabrication material selected from said plurality of raw fabrication materials.

12. The apparatus of claim 11, wherein said fabrication cabinet further comprises:

a material supply system containing said plurality of fabrication materials;

a material queue configured to receive and store predetermined amounts of said plurality of fabrication materials; and

a material delivery support system arranged to receive said plurality of fabrication materials from said material queue and to provide said plurality of fabrication materials to said applicator assembly.

13. The apparatus of claim 12, wherein said fabrication cabinet further comprises:

a shuttle assembly configured and arranged to remove the circuit board from said fabrication base upon completion of fabrication.

14. The apparatus of claim 13, wherein said fabrication cabinet further comprises:

an accumulator arranged to receive the circuit board from said shuttle assembly.

15. The apparatus of claim 14, wherein said fabrication cabinet further comprises:

an elevator assembly arranged to receive the circuit board from said accumulator and to remove the circuit board from said fabrication cabinet.

16. A computer-based method for fabricating a circuit board, comprising the steps of:

(a) receiving design data representing a layout of the circuit board;

(b) transforming said design data in a three-dimensional matrix of increments, each increment being identified with said matrix by an address and being assigned a fabrication material selected from a plurality of such fabrication materials, said transforming step comprising

(1) calculating an increment size based on design features of the circuit board,

(2) generating a generic matrix of increments approximately representing physical dimensions of the circuit board,

(3) removing increments from selected locations of said generic matrix to form cut-out features of the circuit board,

(4) adding increments to selected locations of said generic matrix to form protruding features of the circuit board, and

(5) assigning a fabrication material to each increment in said generic matrix; and

(c) depositing said assigned fabrication materials onto a fabrication base in an incremental fashion as indicated by said matrix to fabricate the circuit board.

17. A computer-based system for fabricating a circuit board, comprising:

transformation means for receiving data specifying design requirements of the circuit board and for generating, from said data, a three-dimensional matrix of increments, each increment being identified within said matrix by an address and being assigned a fabrication material selected from a plurality of such fabrication materials;

base means for providing a fabrication site for the circuit board; and

fabrication means for depositing said assigned fabrication materials onto said base means in an incremental three-dimensional fashion as indicted by said matrix to thereby three-dimensionally fabricate the circuit board, said fabrication means comprising

raw material supply means for receiving fabrication materials to be used in the fabrication of the circuit board,

applicator means for receiving said fabrication materials from said raw material supply means and for depositing incremental quantities of said fabrication materials on said base means,

positioning means for positioning said applicator means relative to said base means, and

control means for controlling said applicator means and said positioning means to fabricate the circuit board in accordance with said matrix.