Peltier module

• US 5,841,064 A
• Filed: 01/24/1997
• Issued: 11/24/1998
• Est. Priority Date: 05/26/1995
• Status: Expired due to Term

• Current Assignee: Panasonic Electric Works Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Asahi Matsushita Electric Works Ltd. (Panasonic Holdings Corporation)
• Inventors: Okada, Hiroaki, Inoue, Hiroyuki, Murase, Shinya, Komatsu, Teruaki, Maekawa, Nobuteru, Shimoda, Katsuyoshi
• Primary Examiner(s): Gorgos, Kathryn L.
• Assistant Examiner(s): CARROLL, CHRISMAN DION
• Application Number:
  US08/776,186
• Time in Patent Office: 669 Days
• Field of Search: 136/203, 136/204, 136/224, 136/225, 136/230, 136/236.1, 136/237, 62/3.2
• US Class Current: 136/203
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

A Peltier effect module comprising a plurality of Peltier effect elements arranged in parallel between a pair of substrates where the Peltier effect elements are connected to connection electrodes disposed on the substrates. The array of Peltier effect elements is sealed off by a hollow seal frame surrounding the Peltier effect element array with a seal formed by a bond between both end edges of the seal frame and the substrates. Because the perimeter around the Peltier effect elements is sealed using a seal frame metalically bonded at both ends to the substrates, resistance to moisture penetration is largely determined by the material from which the seal frame is made. Therefore, by appropriately selecting the seal frame materials, the Peltier effect module can be reliably protected for a long period of time against moisture penetration.

Claims

1. A Peltier effect module comprising:

a pair of substrates arranged opposite to each other;

connection electrodes formed on each opposed surface of the pair of substrates;

a pair of power supply lead electrodes each formed in a closed loop and enclosing the connection electrodes on each opposed surface of the pair of substrates;

plural Peltier effect elements arranged in parallel between the pair of substrates; and

a hollow seal frame positioned between the pair of substrates to surround the plural Peltier effect elements, the seal frame having upper and lower ends for metallic bonding wherein the upper and lower ends of the seal frame are metallically bonded to respective power supply lead electrodes, thereby sealing each end of the seal frame and each substrate.

2. The Peltier effect module according to claim 1 wherein the hollow seal frame is made from a plastic member with a metal coating formed at the connection with the power supply lead.

3. The Peltier effect module according to claim 1 wherein the hollow seal frame is made from a drawn stainless steel plate with a metal coating formed at the connection with the power supply lead.

4. The Peltier effect module according to claim 1 wherein the hollow seal frame is made from a paper member treated with a waterproofing process.

5. The Peltier effect module according to claim 1, wherein each power supply lead electrode comprises a terminal block that connects to external leads on the substrate disposed externally of the seal frame.

6. The Peltier effect module according to claim 1 wherein the substrates are made from a shaped aluminum member treated with an alumina or silicon dioxide coating, and the connection electrodes and power supply lead electrodes are made by the use of a flame spray method.

7. The Peltier effect module according to claim 1 wherein the pair of substrates is further supported outside the seal frame by plural support pillars.

8. The Peltier effect module according to claim 1, wherein the substrate on which the connection electrodes are disposed comprises a thermal stress absorber disposed between the connections of the mounted Peltier effect element that deforms according to thermal stress.

9. The Peltier effect module according to claim 8 wherein the thermal stress absorber is a ridge member formed between the bonds of the Peltier effect elements.

10. The Peltier effect module according to claim 9 wherein the ridge members also function as positioning members for the Peltier effect elements.

11. The Peltier effect module according to claim 1 wherein the Peltier effect elements are connected to the substrates through a buffer member, said buffer member being used to alleviate thermal stress, and being made from a material with high electrical and thermal conductivity, and having a Young'"'"'s modulus substantially equal to that of the Peltier effect elements.

12. The Peltier effect module according to claim 11 wherein the buffer member is made from annealed copper.

13. The Peltier effect module according to claim 11 wherein a soldering temperature used to bond the Peltier effect elements and buffer members is higher than the soldering temperature used to bond the buffer members to the substrates.

14. The Peltier effect module according to claim 11 wherein a precious metal conductive paste is used for the bonds between the Peltier effect elements and buffer members, or the bonds between the buffer members and substrates.

15. The manufacturing method for the Peltier effect module according to claim 1 wherein a buffer member used to alleviate thermal stress which is made from a material with high electrical and thermal conductivity, and a Young'"'"'s modulus substantially equal to that of the Peltier effect elements, and is laminated to both surfaces of the Peltier effect element wafer, wherein the resulting lamellar body is then cut to form Peltier effect element chips with a buffer member bonded to both sides of the Peltier effect elements, wherein the Peltier effect element chips are arrayed between a pair of substrates, and wherein the substrates and buffer members of the Peltier effect element chips are then bonded together.