Conductive layer with anti-reflective surface portion

• US 5,841,179 A
• Filed: 08/28/1996
• Issued: 11/24/1998
• Est. Priority Date: 08/28/1996
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Singh, Bhanwar, Pramanick, Shekhar, Ng, Che-Hoo
• Primary Examiner(s): Hardy, David B.
• Application Number:
  US08/704,162
• Time in Patent Office: 818 Days
• Field of Search: 257/741, 257/765, 257/758-763, 257/771, 257/437, 257/739, 257/773, 437/228, 437/17, 437/241, 437/472, 430/271, 430/187, 156/228, 359/279, 438/665, 438/795, 438/964, 438/969
• US Class Current: 257/437
• CPC Class Codes: H01L 21/0276 using an anti-reflective coating anti-reflective coating for lithography in general G03F7/09
• CPC Class Codes: H01L 21/76886 Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
• CPC Class Codes: H01L 21/76888 By rendering at least a portion of the conductor non conductive, e.g. oxidation
• CPC Class Codes: Y10S 438/952 Utilizing antireflective layer

Abstract

The application of a dissimilar anti-reflective coating on a conductive layer during photolithographic processing is avoided, as by modifying a portion of the upper surface of the conductive layer to exhibit anti-reflective properties. In an embodiment of the present invention, impurity ions are implanted into a portion of the upper surface of an aluminum or an aluminum-alloy conductive layer to render the upper portion substantially amorphous and, hence, decrease its reflectivity to perform an anti-reflective function.

Claims

1. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implantation thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion, and the reflectivity of the upper portion was reduced to less than about 50% of the reflectivity of the remainder of the conductive layer.

2. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implanting impurity atoms thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion and the conductive layer comprises a metal and the implanted impurity atoms are heavier than metal atoms of the conductive layer.

3. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implantation thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion and the conductive layer comprises a metal, the anti-reflective upper portion is substantially amorphous, and the remainder of the conductive layer is substantially crystalline.

4. The semiconductor device according to claim 3, wherein the upper portion has been rendered substantially amorphous by ion implantation.

5. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implantation thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion and the conductive layer comprises an interconnection pattern defined by a plurality of conductive lines having an interwiring spacing less than about 1 micron.

6. The semiconductor device according to claim 5, wherein the conductive layer comprises aluminum, an aluminum-alloy, copper or a copper-alloy.

7. The semiconductor device according to claim 6, wherein the conductive layer comprises aluminum or an aluminum-alloy.

8. The semiconductor device according to claim 7, wherein the anti-reflective upper portion is substantially amorphous, and the remainder of the conductive layer is substantially crystalline.

9. The semiconductor device according to claim 8, wherein the upper portion has been rendered substantially amorphous by implanting an impurity selected from the group consisting of Ge, Si, Ar, Xe and Kr.

10. The semiconductor device according to claim 9, wherein the impurity is Ge or Si.

11. The semiconductor device according to claim 8, wherein the substantially amorphous anti-reflective upper portion has been crystallized.

12. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implantation thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion and the thickness of the anti-reflective upper portion is less than about 1000Å

.

13. A semiconductor device comprising:

a substrate;

an insulating layer formed on the substrate; and

a conductive layer having an upper surface and a lower surface formed above the insulating layer;

wherein

the upper surface comprises an ion implanted, converted anti-reflective upper portion extending into the conductive layer, which anti-reflective upper portion is formed by ion implantation thereby altering the reflectivity and converting the upper surface of the conductive layer into the anti-reflective upper portion and the lower surface of the conductive layer is formed on a metallic underlayer.

14. A semiconductor device, comprising:

a substrate;

an insulating layer on the substrate;

a conductive interconnect pattern on the insulating layer, the conductive interconnect pattern comprising a plurality of metal lines separated by an interwiring spacing less than about one micron, at least one metal line having a substantially amorphous anti-reflective film thereon of the same metal as the metal line, which substantially amorphous anti-reflective film is formed by ion implanting the metal line to alter its surface reflectivity.

15. The semiconductor device according to claim 14, wherein the metal comprises aluminum, an aluminum-alloy, copper or a copper alloy.

16. The semiconductor device according to claim 15, wherein the anti-reflective film is substantially amorphous and the metal line is substantially crystalline.

17. The semiconductor device according to claim 15, wherein the metal comprises aluminum or an aluminum alloy.

18. The semiconductor device according to claim 17, wherein the aluminum or aluminum-alloy is on a barrier underlayer comprising titanium, titanium nitride or titanium/titanium nitride.