Liquid-cooled baffle series/parallel heat sink
First Claim
1. A liquid-cooled heat sink comprising:
- a cooling housing including at least one chamber, said at least one chamber including at least one wall that is to be cooled;
a fluid inlet port in fluid communication with the housing;
a fluid outlet port in fluid communication with the housing; and
at least one baffle positioned within said chamber, said baffle including a horizontal dividing wall separating the chamber into a top chamber portion and a bottom chamber portion, said horizontal wall including at least one set of jet ports, said set of jet ports directing liquid coolant onto the at least one wall that is to be cooled, said baffle including at least one top dividing wall separating the top chamber portion into first and second top plenums, and at least one bottom dividing wall separating the bottom chamber portion into first and second bottom plenums, said horizontal wall further including at least one transfer port, wherein liquid coolant enters the bottom chamber portion through the fluid inlet port into the first bottom plenum and is forced into the first top plenum through the at least one set of jet ports to contact the at least one wall that is to be cooled, and flows from the first top plenum through the at least one transfer port to the second bottom plenum.
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Accused Products
Abstract
A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port removes the liquid coolant from the chamber. A single unit plastic baffle is positioned within the chamber. The baffle includes strategically configured plenums, jet ports and transfer ports that direct the liquid coolant in both a series and parallel manner for increased cooling efficiency. The jet ports direct the liquid coolant onto the semiconductor devices in a parallel manner, and liquid coolant is transferred from one set of jets to another set of jets in a series manner.
124 Citations
18 Claims
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1. A liquid-cooled heat sink comprising:
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a cooling housing including at least one chamber, said at least one chamber including at least one wall that is to be cooled; a fluid inlet port in fluid communication with the housing; a fluid outlet port in fluid communication with the housing; and at least one baffle positioned within said chamber, said baffle including a horizontal dividing wall separating the chamber into a top chamber portion and a bottom chamber portion, said horizontal wall including at least one set of jet ports, said set of jet ports directing liquid coolant onto the at least one wall that is to be cooled, said baffle including at least one top dividing wall separating the top chamber portion into first and second top plenums, and at least one bottom dividing wall separating the bottom chamber portion into first and second bottom plenums, said horizontal wall further including at least one transfer port, wherein liquid coolant enters the bottom chamber portion through the fluid inlet port into the first bottom plenum and is forced into the first top plenum through the at least one set of jet ports to contact the at least one wall that is to be cooled, and flows from the first top plenum through the at least one transfer port to the second bottom plenum. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An inverter module for converting DC voltage signals to AC voltage signals, said module comprising:
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a housing, said housing including at least one cover and at least one cooling chamber portion; a fluid inlet port in fluid communication with the cooling chamber portion; a fluid outlet port in fluid communication with the cooling chamber portion; a substrate plate positioned within the housing, said substrate plate supporting a plurality of semiconductor devices, said substrate plate being a wall of the cooling chamber portion; and at least one baffle positioned within said cooling chamber portion, said baffle including a horizontal dividing wall separating the cooling chamber portion into a top cooling chamber portion and a bottom cooling chamber portion, said horizontal wall including at least one set of jet ports, said set of jet ports directing liquid coolant onto a backside of the plate opposite to the semiconductor devices, said baffle including at least one top dividing wall separating the top coolant chamber portion into first and second top plenums, and at least one bottom dividing wall separating the bottom coolant chamber into first and second bottom plenums, said horizontal wall further including at least one transfer port, wherein liquid coolant enters the bottom chamber portion through the fluid inlet port into the first bottom plenum and is forced into the first top plenum through the at least one set of jet ports to contact the plate, and flows from the first top plenum through the at least one transfer port to the second bottom plenum. - View Dependent Claims (13, 14, 15, 16)
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17. A liquid-cooled heat sink comprising:
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a cooling chamber, said cooling chamber including a wall to be cooled; a fluid inlet port in fluid communication with the cooling chamber; a fluid outlet port in fluid communication with the chamber; and a baffle positioned within the chamber, said baffle including a horizontal dividing wall separating the chamber into a top chamber portion and a bottom chamber portion, said horizontal wall including first, second and third sets of eight jet ports, each of said set of jet ports directing liquid coolant onto the wall to be cooled, said baffle further including two top dividing walls separating the top chamber portion into first, second and third top plenums, two bottom dividing walls separating the bottom chamber portion into first, second and third bottom plenums, and first, second and third transfer ports extending through the horizontal wall, wherein liquid coolant enters the bottom chamber portion through the fluid inlet port into the first bottom plenum and is forced through the first set of jet ports to contact the wall to be cooled in the first top plenum, then flows from the first top plenum through the first transfer port into the second bottom plenum, then flows from the second bottom plenum through the second set of jet ports to contact the wall to be cooled in the second top plenum, then flows from the second top plenum through the second transfer port to the third bottom plenum, then flows from the third bottom plenum through the third set of jet ports to contact the wall to be cooled in the third top plenum, and then flows from the third top plenum through the third transfer port out of the fluid outlet port. - View Dependent Claims (18)
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Specification