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Inspection data analyzing system

  • US 5,841,893 A
  • Filed: 06/30/1992
  • Issued: 11/24/1998
  • Est. Priority Date: 07/12/1989
  • Status: Expired due to Term
First Claim
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1. In an inspection data analysis system in a semiconductor device manufacturing line, including a foreign particle inspection machine for inspecting at least a size, a number, and coordinates of foreign particles on a wafer after working of the wafer in an appropriate process, a probing test machine for testing product character of individual chips of each wafer in an inspection process, and an inspection data analysis station connected to said foreign particle inspection machine and said probing test machine by communication lines, said inspection data analysis station comprising:

  • a storage section for storing inspection data of said foreign particle inspection machine, test data of said probing test machine, and chip arrangement information of each type of wafer;

    input means for accepting an analysis instruction, a type of wafer, a name of a process which the wafer has been subjected to, a lot number, or a wafer number which is selected and inputted by an analysis operator;

    time series foreign particles trend display means for outputting a graph displaying a frequency of a number of foreign particles per any one of wafer, lot, day, week, and month, or a frequency of a number of foreign particles for each particle diameter, on the basis of the inspection and test data stored in said storage section;

    inter-process foreign particle number trend display means for outputting a graph displaying a frequency of a number of foreign particles or a frequency of a number of foreign particles for each particle diameter in each process in the order of inspection on the basis of the inspection and test data stored in said storage section; and

    foreign particle yield correlation display means for outputting a primary regression line obtained from a plurality of points which are plotted on a graph, each of said points representing a wafer yield corresponding to a number of foreign particles for each wafer of a specified type and lot number, on the basis of the inspection and test data stored in said storage section; and

    yield for each foreign particle diameter display means for displaying on a graph a yield for each of chips having no foreign particle and for each of chips having foreign particles, by classifying each chip in each wafer of a specified type and lot number in accordance with the presence or absence of foreign particles and a maximum particle diameter of foreign particles attached to said each chip, said classifying being performed on the basis of the inspection and test data and the chip arrangement information for each type of wafer stored in said storage section.

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