Method of producing micro-electrical conduits
First Claim
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1. A method of forming, in a substrate, a fluid-tight electrical conduit through a high aspect ratio hole of at least about 3 the method comprising fusing a via ink to form the electrical conduit and to seal the hole.
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Abstract
The present invention provides a method of forming a fluidtight electrical conduit through a high aspect ratio hole, the method comprising sintering a via ink to form the electrical conduit and to seal the hole.
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22 Claims
- 1. A method of forming, in a substrate, a fluid-tight electrical conduit through a high aspect ratio hole of at least about 3 the method comprising fusing a via ink to form the electrical conduit and to seal the hole.
Specification